A polycrystalline cubic boron nitride comprising 96% by volume or more of cubic boron nitride, wherein the cubic boron nitride has a dislocation density of 810.sup.15/m.sup.2 or less, the polycrystalline cubic boron nitride comprises a plurality of crystal grains, and the plurality of crystal grains have a median diameter d50 of an equivalent circle diameter of less than 100 nm.

A polycrystalline cubic boron nitride comprising 96% by volume or more of cubic boron nitride, wherein the cubic boron nitride has a dislocation density of 810.sup.15/m.sup.2 or less, the polycrystalline cubic boron nitride comprises a plurality of crystal grains, and the plurality of crystal grains have a median diameter d50 of an equivalent circle diameter of less than 100 nm.

A diamond polycrystal includes diamond grains, the diamond polycrystal including a cubic diamond and a 6H type hexagonal diamond, wherein the cubic diamond and the 6H type hexagonal diamond exist in the same or different diamond grains, and a ratio Ab.sub.1/Ab.sub.2 is more than or equal to 0.4 and less than or equal to 1, Ab.sub.1 representing a maximum value of absorption in a range of more than or equal to 1200 cm.sup.1 and less than or equal to 1300 cm.sup.1 in an infrared absorption spectrum, Ab.sub.2 representing a maximum value of absorption in a range of more than or equal to 1900 cm.sup.1 and less than or equal to 2100 cm.sup.1.

A diamond polycrystal includes diamond grains, the diamond polycrystal including a cubic diamond and a 6H type hexagonal diamond, wherein the cubic diamond and the 6H type hexagonal diamond exist in the same or different diamond grains, and a ratio Ab.sub.1/Ab.sub.2 is more than or equal to 0.4 and less than or equal to 1, Ab.sub.1 representing a maximum value of absorption in a range of more than or equal to 1200 cm.sup.1 and less than or equal to 1300 cm.sup.1 in an infrared absorption spectrum, Ab.sub.2 representing a maximum value of absorption in a range of more than or equal to 1900 cm.sup.1 and less than or equal to 2100 cm.sup.1.

A cutting tool according to an aspect of the present disclosure includes a cutting edge portion which contains at least one of cubic boron nitride and polycrystalline diamond. The cutting edge portion includes a rake face, a flank face, and a cutting edge. The flank face is contiguous to the rake face. The cutting edge is provided as a ridge line between the rake face and the flank face. The radius of curvature of the cutting edge is 2 m or more and 8 m or less.

A cutting tool according to an aspect of the present disclosure includes a cutting edge portion which contains at least one of cubic boron nitride and polycrystalline diamond. The cutting edge portion includes a rake face, a flank face, and a cutting edge. The flank face is contiguous to the rake face. The cutting edge is provided as a ridge line between the rake face and the flank face. The radius of curvature of the cutting edge is 2 m or more and 8 m or less.

Provided is polycrystalline diamond having a diamond single phase as basic composition, in which the polycrystalline diamond includes a plurality of crystal grains and contains boron, hydrogen, oxygen, and the remainder including carbon and trace impurities; the boron is dispersed in the crystal grains at an atomic level, and greater than or equal to 90 atomic % of the boron is present in an isolated substitutional type; hydrogen and oxygen are present in an isolated substitutional type or an interstitial type in the crystal grains; each of the crystal grains has a grain size of less than or equal to 500 nm; and the polycrystalline diamond has a surface covered with a protective film.

Provided is polycrystalline diamond having a diamond single phase as basic composition, in which the polycrystalline diamond includes a plurality of crystal grains and contains boron, hydrogen, oxygen, and the remainder including carbon and trace impurities; the boron is dispersed in the crystal grains at an atomic level, and greater than or equal to 90 atomic % of the boron is present in an isolated substitutional type; hydrogen and oxygen are present in an isolated substitutional type or an interstitial type in the crystal grains; each of the crystal grains has a grain size of less than or equal to 500 nm; and the polycrystalline diamond has a surface covered with a protective film.

An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer diamond grain size 520 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.

An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer diamond grain size 520 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.