A diamond coating includes a first diamond layer made of minute diamond particles and a second diamond layer made of coarse diamond particles: in a flank-face side diamond coating, a mean coat thickness d2 is not less than 3 m and not more than 25 m, a first diamond layer is formed on a surface side and a second diamond layer is formed on a tool base side: a rake-face side diamond coating is in a smaller range of 50 m or 1/10 of a tool diameter from a tip of a base cutting-edge part; in the rake-face side diamond coating, a mean coat thickness d1 is a smaller one in a range not less than 0 m and not more than 5.0 m or a range less than d2: and a boundary part between the first diamond layer and the second diamond layer.

A cutting element (1) for a tool with an electrically conductive track (6) formed at a surface region. The cutting element (1) comprises a HPHT produced polycrystalline diamond body. The conductive track (6) comprises graphite such that the electrically conductive track (6) has an electrical resistance substantially lower than that of the surface region.

A cutting element (1) for a tool with an electrically conductive track (6) formed at a surface region. The cutting element (1) comprises a HPHT produced polycrystalline diamond body. The conductive track (6) comprises graphite such that the electrically conductive track (6) has an electrical resistance substantially lower than that of the surface region.

The edge portion includes an upper surface, a side surface, and a land surface. The side surface has a front side surface and a pair of lateral side surfaces. An intersection between the land surface and the front side surface forms a front cutting edge. An intersection between the land surface and each of the pair of lateral side surfaces form a corresponding one of a pair of lateral cutting edges. The edge portion contains 80 vol % or more of diamond. A chip breaker recess is provided between the upper surface and the land surface. The surfaces forming the chip breaker recess include a rake face and a breaker wall surface. The upper surface has a front edge portion opposite to the front cutting edge from the chip breaker recess. A pair of protruding portions are provided to extend from the front edge portion toward the front cutting edge.

The edge portion includes an upper surface, a side surface, and a land surface. The side surface has a front side surface and a pair of lateral side surfaces. An intersection between the land surface and the front side surface forms a front cutting edge. An intersection between the land surface and each of the pair of lateral side surfaces form a corresponding one of a pair of lateral cutting edges. The edge portion contains 80 vol % or more of diamond. A chip breaker recess is provided between the upper surface and the land surface. The surfaces forming the chip breaker recess include a rake face and a breaker wall surface. The upper surface has a front edge portion opposite to the front cutting edge from the chip breaker recess. A pair of protruding portions are provided to extend from the front edge portion toward the front cutting edge.

A cutting tool according to an aspect of the present disclosure includes a shank, a joint, and a cutting portion attached through the joint to the shank. The cutting portion includes a core and a surface portion. The surface portion is disposed around a central axis of the cutting portion to cover an outer circumferential surface of the core. The surface portion includes a cutting edge. The cutting edge is disposed on an outer circumferential surface of the surface portion and formed in a helical shape about the central axis. The surface portion is a composite sintered material including a hard phase formed of a plurality of diamond particles and a plurality of cubic boron nitride particles, and a binder phase forming the remainder.

A cutting tool according to an aspect of the present disclosure includes a shank, a joint, and a cutting portion attached through the joint to the shank. The cutting portion includes a core and a surface portion. The surface portion is disposed around a central axis of the cutting portion to cover an outer circumferential surface of the core. The surface portion includes a cutting edge. The cutting edge is disposed on an outer circumferential surface of the surface portion and formed in a helical shape about the central axis. The surface portion is a composite sintered material including a hard phase formed of a plurality of diamond particles and a plurality of cubic boron nitride particles, and a binder phase forming the remainder.

In an X-ray topography image for a crystal growth main surface of a single-crystal diamond, a group of crystal defect points are gathered, each of the crystal defect points being a tip point of a crystal defect line reaching the crystal growth main surface, the crystal defect line representing a line in which a crystal defect exists. Further, in the single-crystal diamond, a plurality of crystal defect line-like gathered regions exist in parallel. In the plurality of crystal defect line-like gathered regions, groups of crystal defect points are gathered to extend in the form of lines in a direction angled by not more than 30 relative to one arbitrarily specified direction. Accordingly, a single-crystal diamond is provided which is used suitably for a cutting tool, a polishing tool, an optical component, an electronic component, a semiconductor material, and the like.

In an X-ray topography image for a crystal growth main surface of a single-crystal diamond, a group of crystal defect points are gathered, each of the crystal defect points being a tip point of a crystal defect line reaching the crystal growth main surface, the crystal defect line representing a line in which a crystal defect exists. Further, in the single-crystal diamond, a plurality of crystal defect line-like gathered regions exist in parallel. In the plurality of crystal defect line-like gathered regions, groups of crystal defect points are gathered to extend in the form of lines in a direction angled by not more than 30 relative to one arbitrarily specified direction. Accordingly, a single-crystal diamond is provided which is used suitably for a cutting tool, a polishing tool, an optical component, an electronic component, a semiconductor material, and the like.

An object of the present invention is to provide a powder coating material capable of forming a coating film excellent in weather resistance, whereby formation of color unevenness or pinholes is suppressed. Further, another object of the present invention is to provide a method for producing the powder coating material and a coated article. The powder coating material of the present invention comprises a powder component containing a fluorinated copolymer which has repeating units based on a fluoroolefin and repeating units based on a monomer having no fluorine atom and which has a fluorine content of at least 10 mass %, and a plasticizer-covered luster pigment, wherein the plasticizer has a melting point of from 30 to 200 C. and a molecular weight of from 200 to 1,000 and which has from 1 to 4 ester groups in one molecule.