B23B27/20

CUTTING INSERT AND METHOD OF MANUFACTURING CUTTING INSERT

A cutting insert includes a substrate and a cutting-edge insert. The substrate has, in a thickness direction of the substrate, a bottom surface, and a top surface opposite to the bottom surface. The top surface has a polygonal shape composed of a plurality of sides in a plan view as seen along the thickness direction. The top surface is provided with a projection projecting to a side opposite to the bottom surface along the thickness direction. The projection has a through-hole passing through the substrate along the thickness direction. The projection has a side surface contiguous to the top surface. The side surface is composed of a curved line protruding to a side opposite to the through-hole in the plan view as seen along the thickness direction.

Laser assisted micromachining system and temperature control method using same

A laser assisted micromachining system, includes a working sliding, a tool module, a laser module, and a temperature control module for the processing of a workpiece. The laser module is disposed in the working slide and moves with the working slide in three-dimensional space. The temperature control module includes a temperature sensor, a cooler, a controller and a coolant, which detects the real-time temperature value of the cooler. The cooler is located in the working slide and supports the tool module. The controller controls the working state of the cooler according to the temperature feedback. Control signal induced by the temperature indicator, and the working state of the cooler are controlled by the controller. The coolant is used to control the temperature distribution of the cooler in the setting range. At the same time, the invention also provides a temperature control method for the laser assisted micro machining system.

DIAMOND-COATED TOOL
20230294178 · 2023-09-21 ·

A diamond-coated tool comprising a base material made of a cemented carbide and a diamond layer disposed on the base material, wherein when a cross section of the diamond layer along a normal line to a surface of the diamond layer is observed using a scanning electron microscope, the diamond layer has an average void area ratio of 0% or more and 0.2% or less in a region R surrounded by an interface S1 between the base material and the diamond layer and a virtual surface Q that is located at a distance of 5 μm from interface S1 toward a surface side of the diamond layer.

DIAMOND-COATED TOOL
20230294178 · 2023-09-21 ·

A diamond-coated tool comprising a base material made of a cemented carbide and a diamond layer disposed on the base material, wherein when a cross section of the diamond layer along a normal line to a surface of the diamond layer is observed using a scanning electron microscope, the diamond layer has an average void area ratio of 0% or more and 0.2% or less in a region R surrounded by an interface S1 between the base material and the diamond layer and a virtual surface Q that is located at a distance of 5 μm from interface S1 toward a surface side of the diamond layer.

POLYCRYSTALLINE DIAMOND COMPACTS AND APPLICATIONS THEREFOR

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

Diamond polycrystal, tool including diamond polycrystal, and method of producing diamond polycrystal

A diamond polycrystal includes diamond grains, the diamond polycrystal including a cubic diamond and a 6H type hexagonal diamond, wherein the cubic diamond and the 6H type hexagonal diamond exist in the same or different diamond grains, and a ratio Ab.sub.1/Ab.sub.2 is more than or equal to 0.4 and less than or equal to 1, Ab.sub.1 representing a maximum value of absorption in a range of more than or equal to 1200 cm.sup.−1 and less than or equal to 1300 cm.sup.−1 in an infrared absorption spectrum, Ab.sub.2 representing a maximum value of absorption in a range of more than or equal to 1900 cm.sup.−1 and less than or equal to 2100 cm.sup.−1.

Diamond polycrystal, tool including diamond polycrystal, and method of producing diamond polycrystal

A diamond polycrystal includes diamond grains, the diamond polycrystal including a cubic diamond and a 6H type hexagonal diamond, wherein the cubic diamond and the 6H type hexagonal diamond exist in the same or different diamond grains, and a ratio Ab.sub.1/Ab.sub.2 is more than or equal to 0.4 and less than or equal to 1, Ab.sub.1 representing a maximum value of absorption in a range of more than or equal to 1200 cm.sup.−1 and less than or equal to 1300 cm.sup.−1 in an infrared absorption spectrum, Ab.sub.2 representing a maximum value of absorption in a range of more than or equal to 1900 cm.sup.−1 and less than or equal to 2100 cm.sup.−1.

Electronic device case and manufacturing method therefor
11812572 · 2023-11-07 · ·

Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.

Electronic device case and manufacturing method therefor
11812572 · 2023-11-07 · ·

Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.

Throwaway insert

The throwaway insert includes a base and a cutting edge member. The cutting edge member includes a rake face, a flank face, a first connecting face, a second connecting face, and a first ridgeline serving as a cutting edge. The rake face includes a main surface and a first chamfer provided at an edge tip portion of the cutting edge member, the edge tip portion including an extreme tip portion of the cutting edge member. In a plan view from an upper surface of the base, the flank face, the first connecting face, and the second connecting face are located external to the base. The first chamfer is inclined relative to the main surface so as to increase a thickness of the cutting edge member as the first chamfer is closer to the main surface.