A wire electrical discharge machine for performing electrical discharge machining on a workpiece to be machined by applying voltage to an electrode gap formed between a wire electrode and the workpiece to generate electrical discharge at the electrode gap under predetermined machining conditions while conveying the wire electrode along a transfer path, includes: a wire breakage detector for detecting a breakage of the wire electrode; a position calculator for calculating the breakage position of the wire electrode in the transfer path; and an adjustment unit for adjusting the machining conditions when the breakage position is in a predetermined section of the transfer path.

A wire electric discharge machining apparatus includes upper and lower wire guide units including wire guides configured to position and guide a wire electrode and a jet nozzle configured to supply a jet flow coaxially with the wire electrode, and a core holding pad having a through-hole passing therethrough in an upward/downward direction, and in which a plurality of protrusion sections having an equal distance from upper surfaces thereof to a lower surface of the workpiece are formed. The core holding pad is disposed on the lower wire guide unit such that the core holding pad approaches the lower surface of the workpiece as closely as possible.

The present invention is directed to a current feeding device for the supply of electrical current to a wire electrode traveling in an electro-erosion machine during the machining operation. The current feeding device comprising: a rotary electrically conductive body which is in contact with the wire electrode; at least one bearing for supporting the rotary electrically conductive body at one side; and a brush for electrically contacting the rotary electrically conductive body and for supporting the rotary electrically conductive body at the other side of the body and opposite side to the bearing. The brush is at the rotary axis of the rotary electrically conductive body.

A wire electrical discharge machine includes a wire feeding hole position acquisition unit configured to obtain a position of a wire feeding hole that allows for insertion and feeding of a wire electrode. In this wire electrical discharge machine, when the position of the wire feeding hole obtained by the wire feeding hole position acquisition unit is deviated from a wire feeding position defined by a machining program, a wire feeding control unit controls a machine main body to move the wire electrode to the position of the wire feeding hole and feed the wire electrode there, and a machining control unit controls the machine main body to perform electrical discharge machining on a workpiece with the wire electrode while moving the wire electrode on a path segment between a position where the wire electrode has been fed and the wire feeding position defined by the machining program.

A wire electrical discharge machine includes: a guide pipe as a guide member arranged on a path for feeding a wire electrode from a feed roller toward a workpiece and having a passage hole through which the wire electrode is passed; an airflow generator for generating a flow of compressed air in the passage hole and switching a flow direction of compressed air flowing through the passage hole between a forward direction and a reverse direction; a deflection detector for detecting a deflection of the wire electrode; and a control device for controlling the airflow generator so as to generate a flow of compressed air in the forward direction in the passage hole during auto wire feeding and, when the deflection detector detects the deflection, change the flow direction of compressed air to the reverse direction and thereafter switch the flow direction of compressed air to the forward direction.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A wire guide device of a wire electrical discharge machine includes a first roller shaft, a first wire guide roller provided at an end of the first roller shaft, a second roller shaft, and a second wire guide roller provided at an end of the second roller shaft and having an end face in an axial direction provided to face an end face of the first wire guide roller in the axial direction. The first wire guide roller and the second wire guide roller have a conical surface and a conical surface with which a wire electrode is in contact.

A wire guide device of a wire electrical discharge machine includes a first roller shaft, a first wire guide roller provided at an end of the first roller shaft, a second roller shaft, and a second wire guide roller provided at an end of the second roller shaft and having an end face in an axial direction provided to face an end face of the first wire guide roller in the axial direction. The first wire guide roller and the second wire guide roller have a conical surface and a conical surface with which a wire electrode is in contact.

Provided is a prediction device, to which one or more wire electrical discharge machines are connected, the one or more wire electrical discharge machines each performing machining on an object to be machined according to a predetermined machining condition while moving a wire electrode relatively with respect to the object to be machined along a machining path, the prediction device including a prediction unit that predicts, for a predetermined component constituting the wire electrical discharge machine, a predicted rate of consumption indicative of a rate of consumption based on the machining condition when the wire electrode is moved relatively by a unit distance, and a display unit that displays the predicted rate of consumption of the component.