B23K3/026

Soldering Tip Fastening Device
20190126376 · 2019-05-02 ·

A soldering tip fastening device includes a soldering device fastener configured for fastening the soldering tip fastening device on a soldering device, and a soldering tip fastener configured to fasten a soldering tip on a soldering device when the soldering tip fastening device is fastened to the soldering device. The soldering tip fastener and the soldering device fastener are associated with opposite ends of the soldering tip fastening device. The soldering tip fastening device has a sleeve with an elastic element, the sleeve being configured such that the elastic element is tensioned during the fastening of the soldering tip on the soldering device by the soldering tip fastening device.

SOLDERING TIP FOR A SOLDERING IRON
20190015918 · 2019-01-17 ·

A soldering tip for a soldering iron is presented. In one aspect, the soldering tip is used in a hand-held soldering iron for soldering an electrical connection element on an electrically conductive structure on a substrate. The soldering tip includes a substantially hemispherical end portion. Also presented is a method for producing a pane with an electrical connection element using the soldering tip with a hand-held soldering iron.

Soldering tip fastening system
10005147 · 2018-06-26 · ·

The present invention relates to a soldering tip fastening sleeve (3) comprising a soldering device fastening portion (7) and a soldering tip fastening portion (6). The soldering device fastening portion (7) has an internal measurement (15) and an external measurement. Also the soldering tip fastening portion (6) has an internal measurement (16) and an external measurement (14) as well as a collar holder (10). The soldering tip fastening portion (6) and the soldering device fastening portion (7) are associated with different ends of the soldering tip fastening sleeve (3). The soldering tip fastening sleeve (3) according to the present invention is characterized in that the collar holder (10) is provided on a first subsector (17) of a circumference of the soldering tip fastening sleeve (3). The present invention also relates to a soldering tip (2) comprising a soldering portion (4) and a fastening portion (5). The soldering tip (2) is adapted to be fixed to a soldering device (30) through the fastening portion (5), a maximum external measurement (5a) of said fastening portion (5) being equal to or smaller than a maximum external measurement (4a) of the soldering portion (4), or the soldering portion being angled. The soldering tip (2) according to the present invention is characterized in that the fastening portion (5) comprises a collar (9).

Soldering tip assembly for an electric soldering device, in particular a soldering iron, soldering device, and soldering system
12172238 · 2024-12-24 · ·

The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

Method and apparatus for fixing a soldering tip to a soldering tool
12162095 · 2024-12-10 · ·

A soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tip portion may include a tip that is heated to melt solder by a heating element controlled by the controller. The tip is operably coupled to the heating element via a braze joint. The heating element may be operable at a first temperature range for melting the solder and a second temperature range, higher than the first temperature range, to facilitate forming or braking the braze joint.

Heater sensor complex with high thermal capacity

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

Stand, and soldering system with stand and soldering device
12269126 · 2025-04-08 · ·

The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

Heater Sensor Complex With High Thermal Capacity

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.

COMBUSTION TOOL WITH DETACHABLE HEATING UNIT
20250276395 · 2025-09-04 ·

A combustion tool with a detachable heating unit includes: a main body having an insertion pipe, an outer circumferential surface of the insertion pipe is axially formed with at least one insertion having a wedge locking tenon disposed therein; and an unlocking mechanism including a push button, the push button has a block sheet abutting against an elastic member, the block sheet compresses the elastic member, and the push button is automatically recovered to an original position through the elastic member; and a heating unit including a fasten ring and a heating pipe, an elastic support arm is axially protruded from the fasten ring, one free end of the elastic support arm is disposed with a locking hook inserted in the at least one insertion slot and moved along a the wedge locking tenon to form a locking or an unlocking status.

SOLDERING TIP AND METHOD

A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus; and a distal end, the distal end having an outer surface, at least a region of which is formed from a second material, different to the first, the second material exhibiting greater solder wettability characteristics than the first material. The first material is preferably titanium or a titanium alloy and the region is preferably formed on the first material by first using a physical vapour deposition (PVD) process to create a first coating on at least a first part of the first material, which first part underlies the region, and then coating at least a part of that first coating with the second material.