The disclosure relates to a soldering device for soldering components, and comprises a linear unit that is configured for moving a component placed thereon back and forth along one direction, an optical measuring unit comprising a detection region directed onto a portion of the linear unit in order to measure a component placed on the linear unit, and a soldering unit which is configured for soldering a first constituent of the component, preferably a sphere, to a second constituent of the component, preferably a wire.