A method for producing a heat exchanger is disclosed. The method includes a) providing two heat exchanger plates of the heat exchanger that are to be joined to one another; b) wetting at least one common local joining zone of the two heat exchanger plates with solder; c) forming the heat exchanger by brazing the two heat exchanger plates via local heating of the at least one common joining zone.

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board.

A reflow device configured to perform reflow soldering on a substrate having a first component and a second component having a heat capacity larger than a heat capacity of the first component. The reflow device includes a plurality of heating sections applying gas to the substrate, a booth accommodating the heating sections, and a controller configured to perform, at least twice or more times, a heating control of controlling the heating sections to increase both of a temperature of the first component and a temperature of the second component, and then reduce the temperature of the first component while increasing the temperature of the second component.

A method for producing a heat exchanger is disclosed. The method includes a) providing two heat exchanger plates of the heat exchanger that are to be joined to one another; b) wetting at least one common local joining zone of the two heat exchanger plates with solder; c) forming the heat exchanger by brazing the two heat exchanger plates via local heating of the at least one common joining zone.

The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone, a plurality of heating devices and a start-stop device. The heating zone comprises a plurality of heating sub-zones, the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval. The start-stop device is configured to activate or deactivate the plurality of heating devices, and the start-stop device is configured in such a way that the start-stop device activates or deactivates the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval. The reflow oven according to the present disclosure can perform soldering and processing of large-sized circuit boards and prevent the occurrence of overheating in a hearth of the reflow oven.

A resistance soldering device configured for use with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.

Method for joining of at least two unweldable materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration, where a two step sequence is used consisting of a first step to apply a thermomechanical or mechanical surface protection layer on the surface of an unweldable material and a second step, where a thermal joining process is used to joint the sprayed layer with an applied layer sheet.