A system and method for joining structures includes a method of joining a first panel to a second panel. A first workpiece formed of a first material is positioned adjacent a second workpiece formed of a second material and joined with a joining process. At least one welding insert is formed from the joined first and second workpieces having an upper portion formed of the first material and a lower portion formed of the second material. The at least one welding insert is positioned between a first panel formed of the first material and a second panel formed of the second material and placed between first and second electrodes of a welding device. First and second electrodes of the welding device generate an electric current to join the first panel, at least one welding insert, and the second panel.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

Example embodiments of the present disclosure relate to methods, systems, and apparatus for joining metallic fabrics. The method includes applying heat to at least one of a fusible metal or alloy, a first metallic fabric, and a second metallic fabric with the fusible metal or alloy and the first and second metallic fabrics being in thermal communication. The first and second metallic fabrics are joined with the fusible metal or alloy.

A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

A controller and a control method for a hot air blower used in the field of solder reworking. The controller allows a user to change the control parameters effectively while using the hot air blower.

The present application relates to a method of controlling a preheating process for preheating a board (2) in preparation for processing of the board (2) in a soldering machine involves: providing a heating unit (11) configured to heat a surface of the board (2), for example a calibration board or an electronics board; providing the board (2) to the heating unit (11); providing electrical power to the heating unit (11) such that the heating unit emits heat; obtaining a profile of heat output from the heating unit (11) and/or a temperature profile of the board (11); and adjusting the electrical power provided to the heating unit (11) to adjust the heat output from the heating unit (11) to the board (11). The present application relates also to a method of maintaining a preheating system and to a preheating apparatus

Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.