This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

A semiconductor package includes a semiconductor substrate, a first conductive pattern on the semiconductor substrate, a top surface of the first conductive pattern including a first inclined surface and a second inclined surface that are inclined with respect to a top surface of the semiconductor substrate, and a distance between the first and second inclined surfaces decreasing away from the top surface of the semiconductor substrate, a second conductive pattern extending along the top surface of the first conductive pattern; and a solder ball disposed on the second conductive pattern.

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.)

A ball attachment apparatus includes a tool case having a bottom surface on which solder balls are adsorbed for attachment to a substrate strip including a plurality of substrate units, a plurality of holding tools in the tool case spaced apart from each other in a first direction, including a plurality of holding regions disposed in the tool case each including adsorption holes, the holding regions respectively corresponding to the substrate units and the adsorption holes respectively corresponding to ball pads of the substrate units, and a plurality of insertion blocks respectively disposed between adjacent ones of the holding tools, wherein, among gaps between the holding tools, a first gap at a first distance from a center of the tool case is different from at least one second gap at a second distance greater than the first distance from the center of the tool case.

The invention relates to a device (10) for the separate application of solder material deposits, in particular solder balls, comprising a conveying device for separately conveying the solder material deposits from a solder material reservoir toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position P1, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to the application device into an application position P3, wherein a removal device (46) for removing a solder material deposit from a transport holder arranged in a removal position P4 is arranged downstream of the transfer position in the conveying direction, the removal device being connected to a detector device for triggering the removal function, said detector device checking the condition of the transport holder in the transfer position.

A pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine and hence, when a failure occurs, the failure cannot be corrected so that an entire silicon wafer as a workpiece is discarded. Provided is a correction method where, on solder bumps formed on the silicon wafer, a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps and, thereafter, molten solder is caused to come into contact with the solder bumps through the mask thus filling hole portions of the mask with the molten solder.

A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge.

A semiconductor package device comprises a first dielectric layer, a first conductive pad and a first conductive element. The first dielectric layer has a first surface and a second surface opposite to the first surface. The first dielectric layer defines a first opening tapered from the first surface toward the second surface. The first conductive pad is within the first opening and adjacent to the second surface of the first dielectric layer. At least a portion of the first conductive element is within the first opening. The first conductive element is engaged with (e.g., abuts) a sidewall of the first opening, the first conductive element having a first surface facing toward the first conductive pad, wherein the first surface of the first conductive element is spaced apart from the first conductive pad.

An article supplying device is provided. The article supplying device has a conveyance portion for conveying conveyed objects, and a movable block. The movable block includes a housing portion capable of housing one conveyed object at a receiving position in which the housing portion communicates with a downstream end of the conveyance portion. The movable block is capable of a reciprocal movement in a direction intersecting a receiving direction of the conveyed objects. Moreover, the movable block includes a biting preventing portion for pushing back a subsequent conveyed object entered into the housing portion after the conveyed object having been housed in the housing portion toward the conveyance portion.

A method of manufacturing includes depositing a braze filler adjacent to a void between a first component and a second component thus holding the components in position before brazing. The first and second components are heated to melt and flow the braze filler into the void. A braze joint is formed between the first and second components by cooling the braze filler. Depositing the braze filler can include laser cladding the braze filler to the first and/or second components adjacent the void. The method also optionally includes welding the first and second components in position with the braze filler adjacent to the void. The braze filler may be deposited as a powder, cold spray, melted brazed filament, spherical ball or any other suitable form.