A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.

A composite material comprising a plurality of round particles bound together by a binding material. Each of the plurality of round particles includes a wear resistant element, an intermediate coating on the wear resistant element, and a round outer layer encapsulating the intermediate coating and the wear resistant element. The intermediate coating is metallurgically bonded to the wear resistant element, and is metallurgically bondable to the binding material.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

Disclosed techniques compensate for variable forces applied to a brazing head in order to more accurately maintain application of a desired lateral force by a brazing wire, filling wire or tracking finger extending from the brazing head to a component. Orientation of the brazing head is determined relative to gravity and the angle of a movable arm of the brazing head relative to a support body of the brazing head. A lateral force value measured by a lateral force sensor is adjustable based on the determined orientation of the brazing head and the determined angle of the arm relative to the support body in order to provide a corrected or adjusted lateral force value. At least a portion of the brazing head is repositioned relative to the component if the corrected lateral force value deviates from a predetermined value.

A welding filler feed-forward maintaining device is provided with a sliding block on a sliding rail mechanism, wherein the sliding jail mechanism is an end shaft of a working space, which is suitable tor use of the end arm of a robot arm, and a main bracket is vertically erected to pivot on the sliding block via a pivoting seat, and the main bracket extends to a welding head at one end, and an end of a solder conduit for soldering is bent toward the soldering tip, and a discharge port for leading the solder is furnished, and a pivoting drive assembly coupled to the pivoting seat is further disposed on the sliding block and is configured to drive the pivoting seat to pivot the main bracket in order to keep the discharge port in front of the weld head along the varying welding direction.

A self-cleaning wire bonding machine includes a spool, a cleaning tank, a drying element, a tensioner, and a nozzle. The spool includes a rotating body and a metal wire wound around the rotating body. The cleaning tank is configured to clean the metal wire after the rotating body passes the metal wire through the cleaning tank. The drying element is configured to dry the metal wire after passing through the cleaning tank. The tensioner is configured to adjust a tension of the metal wire. The nozzle is configured to heat the metal wire, and the metal wire exits out of the nozzle after being heated.

A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.

A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

In a method for regulating or controlling the conveyance speed of a wire composed of consumable material during a laser soldering or welding method, the wire is melted by a laser beam from a laser unit and is conveyed at a mean conveyance speed toward a workpiece to be processed, wherein a voltage between the wire and the workpiece is measured. A laser soldering or laser welding device carries out this method. In order to avoid at least relatively lengthy short-circuit breaking between the end of the wire and the workpiece, the conveyance speed of the wire, as a function of the measured voltage, is temporarily increased to a predetermined boost speed by increasing the conveyance speed to the predetermined boost speed when a defined voltage limit value is exceeded, and the conveyance speed is reduced again at the latest when the voltage limit value falls below.

A system for manufacturing of a sintered wire and in-situ feeding to a laser wire welding system is presented. The system includes a pressure vessel connected to a powder feed system for delivering at least two powders to a powder mixing zone of the pressure vessel. The at least two powders are mixed via a rotating cone in the pressure vessel. After mixing, a heating device contained within the pressure vessel heats the mixture so that liquid phase sintering occurs and a sintered rod is created. The sintered wire is continuously fed to a laser metal deposition system for depositing a layer of additive material on a base material. A method of additively manufacturing or repairing a superalloy component is also presented.