A metal joined body in which a joint is formed from a first metal member and a second metal member. Brazed joint portions provided intermittently with a brazing material and solder joints filling the spaces between the brazed joint portions with a solder having a fusion point lower than the brazing material, are formed at a seam of the joint. The resulting metal joint has excellent sealing properties and little thermal strain.

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

In a method for regulating or controlling the conveyance speed of a wire composed of consumable material during a laser soldering or welding method, the wire is melted by a laser beam from a laser unit and is conveyed at a mean conveyance speed toward a workpiece to be processed, wherein a voltage between the wire and the workpiece is measured. A laser soldering or laser welding device carries out this method. In order to avoid at least relatively lengthy short-circuit breaking between the end of the wire and the workpiece, the conveyance speed of the wire, as a function of the measured voltage, is temporarily increased to a predetermined boost speed by increasing the conveyance speed to the predetermined boost speed when a defined voltage limit value is exceeded, and the conveyance speed is reduced again at the latest when the voltage limit value falls below.

A wire dispenser for a laser metal wire deposition machine comprises a longitudinal duct for guiding a wire from a proximal end to a distal end of the duct. A nozzle unit is connected to the distal end of the duct and has a through bore for receiving the wire from the distal end of the duct and for discharging the wire adjacent to a laser metal wire deposition site. The nozzle unit includes a cooling circuit for a cooling liquid.

A method comprises heating a first electrically conductive layer that is to be electrically contacted, and that is arranged on a first element, and pressing a first end of a bonding wire on the first electrically conductive layer by exerting pressure to the first end of the bonding wire, and further by exposing the first end of the bonding wire to ultrasonic energy, thereby deforming the first end of the bonding wire and creating a permanent substance-to-substance bond between the first end of the bonding wire and the first electrically conductive layer. The bonding wire either comprises a rounded cross section with a diameter of at least 125 m or a rectangular cross section with a first width of at least 500 m and a first height of at least 50 m.

A wire feeder is supplied with a bundle of pre-cut wires held substantially vertical orientation in a wire bin. Through gravity and optionally through vibration, a single strand from the bundle of pre-cut wires falls through a hole in the bottom of the bin, either for hand placement or for automatic placement. The floor of the bin is sloped to help migrate the strands of wire towards the hole in the bottom of the bin.

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

A laser brazing system including a torch body, a wire feed tip, a laser processing head, and a cooling collar. The torch body includes nozzle, mounting, and cooling sections. The nozzle section has a nozzle wall and a feed wire conduit. The cooling section has a cooling barrel, a coolant supply connection, and a coolant return connection. The wire feed tip has a feed wire outlet and is connected to one end of the torch body. The laser processing head directs laser light toward the feed wire outlet. The cooling collar is disposed on the nozzle section and includes a collar body and a coolant conduit. The collar body has a through-bore that receives the nozzle wall. The coolant conduit has an end portion attached to the collar body and a leg portion that transports coolant to and from the end portion.

An electrical connector includes a barrel type terminal, having a first connecting area and a second connecting area. The first connecting area has a first non-soldering surface and a first soldering surface. The second connecting area has a second non-soldering surface and a second soldering surface. Each of the first and second soldering surfaces and the first and second non-soldering surfaces has a first solder layer. A sleeve sheathes outside the barrel type terminal, and has a first fixing area and a second fixing area. Two second solder layers are provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface. The amount of solder provided between the first fixing area and the first soldering surface and between the second fixing area and the second soldering surface is greater than that provided on the first and second non-soldering surfaces.

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.