A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

Discussed is a battery module assembly apparatus using vision, the battery module assembly apparatus including: a transfer unit configured to move in at least one of forwards, rearwards, leftwards and rightwards when a battery module having a battery cell received therein is seated on the transfer unit; a vision unit configured to check a position of the battery module; and a bonding unit configured to electrically connect an electrode of the battery cell and a busbar to each other.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

Component mounting machine includes head, a device for moving head, transfer unit, and a mounting controller. Circular plate is an example of a container in which paste is placed. The bottom face of circular plate and the upper surface of the side wall have a predetermined height relationship. Height sensor is disposed on the lower face of head. Height sensor measures the height of the upper surface of the side wall of circular plate, which is a measurement point. The mounting controller recognizes the height of the bottom face of circular plate or the height of the surface of coating film disposed on circular plate from the height of the top surface of the side wall of circular plate measured by height sensor.

A soldering nozzle (100) for selectively soldering assemblies by means of molten solder supplied through a soldering nozzle (100) from a solder bath. The soldering nozzle (100) is designed as a deep-drawn part. A method for the production of a soldering nozzle (100) is specified as well, including the provision of a blank (401); the drawing of the blank (401) through at least one female die (411, 421) by means of at least one male die (413, 422, 431) to produce an oblong shape (439) of locally annular or substantially annular cross-section, with a first end (436) corresponding to an action point of the male die (413, 422, 431) and a second end (437) corresponding to an introduction cross-section of the male die (413, 422, 431), the cross-section preferably increasing from the first end (436) towards the second end (437); and the formation of an opening (446) at the tip end (436).

Center support for supporting solder material during the transport along a transport direction through a soldering system, transport unit, and soldering system having such a center support.

A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

A stencil for use in stencil printing is disclosed. The stencil is configured to removably attach or rest on an upper surface of an underlying base. The stencil has an opening through which the conductive paste is deposited by spreading the conductive paste across an upper surface of the stencil and forcing the paste into the opening and onto an upper surface of the underlying base. The stencil has a stepped edge at a boundary of the opening. The stepped edge includes a ledge or floor that is configured to hold some of the paste even after a squeegee has removed the paste from an upper surface of the stencil. As the stencil is removed from the base, the ledge or floor can carry the paste that it holds away from the base in an effort to reduce an end-of-track bump on the underlying base.

A stencil printing system for printing solder paste on a base substrate to establish an electrical connection is provided. The system includes a stencil configured to removably attach or rest on an upper surface of the base. The stencil has an opening that provides access to the upper surface of the base. A squeegee spreads conductive paste across the stencil, whereupon the paste can be forced onto the upper surface of the base via the opening. In embodiments, the stencil has a stepped edge at the boundary of the opening. The stepped edge may include a platform or floor that sits lower than the upper surface of the stencil to collect the paste and reduce the amount of paste that falls back to the base as the stencil is removed. The squeegee may have a lower surface that extends oblique relative to the squeegee's leading surface and trailing surface.

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.