A method for bonding a first downhole tool to a borehole tubular. The method may include applying solder particles, each particle having an outer shell and a core of liquid metal, to at least one of a surface of the first downhole tool or a surface of the borehole tubular. The method may also include rupturing the shells of the solder particles to release the liquid metal cores. The method may further include bonding the first downhole tool to the borehole tubular by allowing the released liquid metal core to solidify.

An assembly for use in a downhole tool. The assembly may include a body that includes a chamber with a solder suspension contained therein, the solder suspension comprising solder particles, each solder particle comprising an outer shell and a liquid metal core that is exposed and solidifies upon rupture of the outer shell. The assembly may also include a port that allows fluid flow between the chamber and an area outside of the chamber. The assembly may further include a plunger actuatable to apply a force to create a pressure to the solder suspension within the chamber to eject the solder suspension from the port at a velocity to rupture the outer shells of the particles upon contact with a surface.

The present invention provides a nozzle (201), which comprises a nozzle passage (512) and a fluid passage (511), wherein the nozzle passage has an airflow inlet (515) and an airflow outlet (516). The fluid passage has a fluid passage inlet (518) and a fluid passage outlet (514), wherein the fluid passage inlet communicates with a fluid source so that a fluid can enter the fluid passage, and the fluid passage outlet communicates with the nozzle passage so that the fluid can enter the nozzle passage, and the airflow exerted from the airflow inlet can press the fluid in the nozzle passage out of the airflow outlet. The nozzle provided by the present application can distribute a small volume of a viscous fluid and is not apt to get blocked.

The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

Extrusion dies and methods of manufacturing extrusions dies, the extrusion die including a first plate and a second plate. The first plate has first upstream and downstream surfaces. A first material of the first plate has a first elastic modulus. The first plate includes pins formed between a plurality of slots. The pins and slots define a discharge face for the extrusion die at the first downstream surface of the first plate. The second plate has second upstream and downstream surfaces. The second plate is joined at the second downstream surface to the first upstream surface of the first plate. A second material of the second plate has a second elastic modulus. The second elastic modulus is greater than the first elastic modulus. A plurality of feed holes extend from the second upstream surface of the second plate through the extrusion die into communication with the slots.

In a laser-assisted deposition system, a uniform layer of material is coated onto a donor substrate at a coating system, and portions of the material are jetted from the donor substrate to a receiving substrate at a printing unit, leaving residual portions of the material on the donor substrate. In order to not waste the residual portions of the material, the donor substrate with the residual portions of the material is returned to the coating system where the residual portions of the material are aggregated into a blob and subsequently recoated onto the donor substrate. The blob may be formed by translating the residual portions of the material towards an interface formed by two coating rollers, a squeegee and the donor substrate, or a film and the donor substrate.

The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.

In a laser-assisted deposition system, a uniform layer of material is coated onto a donor substrate at a coating system, and portions of the material are jetted from the donor substrate to a receiving substrate at a printing unit, leaving residual portions of the material on the donor substrate. In order to not waste the residual portions of the material, the donor substrate with the residual portions of the material is returned to the coating system where the residual portions of the material are aggregated into a blob and subsequently recoated onto the donor substrate. The blob may be formed by translating the residual portions of the material towards an interface formed by two coating rollers, a squeegee and the donor substrate, or a film and the donor substrate.

A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.