An electrode orientation checking apparatus includes a machine stand attached to a seam welding apparatus from which one roller electrode of a set has been removed, a positioning guide and a set of distance sensors that are provided on the machine stand, and a calculating section. A positioning surface of the positioning guide is fixed at a position corresponding to a portion of an outer circumferential surface of the one roller electrode before being removed, the portion lying on a line segment connecting rotational centers of the roller electrodes. The distance sensors are respectively fixed forward and backward of the positioning surface in a progression direction of the roller electrodes. The calculating section calculates data for acquiring a direction of the line segment relative to the stacked body.

A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

A bonding probe is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding probe includes a body, an attachment end at a distal end of the body, a head at an opposite end of the body, a tip extending from the head, and a cooling passageway. The attachment end couples the body to a resistance welder. The tip extends to form a proximate end of the body. The tip includes a contacting area having a predetermined three dimensional contoured surface. The contacting area aligns with a predetermined area of a three dimensional outer surface of a cover sheet of a dual walled structure. The cooling passageway provides a passageway for a flow of cooling fluid. The cooling passageway extends through the head, and into the tip.

A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

A spot welding apparatus includes a stationary frame having a housing formed therein. An upper welding gun is mounted to a length direction of a pressing unit disposed in the housing of the stationary frame. A plurality of lower welding guns are mounted on an outside of the stationary frame and ends of the plurality of lower welding guns selectively face one end of the upper welding gun in a length direction of the lower welding guns by the plurality of lower welding guns. A plurality of actuators are mounted on the outside of the stationary frame. A plurality of link units are disposed between the actuators and the lower welding guns, connect the actuators and the lower welding guns, respectively, and rotate as the actuators are operated.

A welding gun includes first and second movable arms, and first and second welding electrodes. The first and second movable arms are movable upward and downward. The first and second welding electrode are disposed respectively on the first and second movable arms. The welding gun is capable of performing a first mode in which the first and second welding electrodes are brought into contact with one side of a workpiece to weld the workpiece, and a second mode in which the workpiece is sandwiched by the first and second welding electrodes to weld the workpiece. The first and second welding electrodes are pivotally supported by the first and second movable arms, respectively. Each of the first and second welding electrodes has a rotatable roller shape. The first movable arm includes a first slide mechanism configured to allow the first welding electrodes to slide to below the second welding electrode.

An electrode orientation checking apparatus includes a machine stand attached to a seam welding apparatus from which one roller electrode of a set has been removed, a positioning guide and a set of distance sensors that are provided on the machine stand, and a calculating section. A positioning surface of the positioning guide is fixed at a position corresponding to a portion of an outer circumferential surface of the one roller electrode before being removed, the portion lying on a line segment connecting rotational centers of the roller electrodes. The distance sensors are respectively fixed forward and backward of the positioning surface in a progression direction of the roller electrodes. The calculating section calculates data for acquiring a direction of the line segment relative to the stacked body.

Described herein is a single-sided welding head including a first welding electrode and a second welding electrode, where the first and second welding electrodes are carried by a body of said welding head. The first welding electrode is movable relative to the body of said welding head at least along a first coordinate of motion. The second welding electrode is movable relative to the body of said welding head at least along a second coordinate of motion; where said first coordinate of motion is a coordinate of angular motion that develops about a first axis of rotation, and said second coordinate of motion is a coordinate of linear motion that develops along a first axis of translation.