Provided is a wire tension adjuster (60) that adjusts tension (T) applied to a wire (18) of a wire bonding apparatus (100). In the wire tension adjuster (60), in a state in which the wire (18) is gripped by a wire clamper (17), air is supplied to a wire tensioner (40) and a height position (H) of a tip (14f) of a bonding arm (14) is detected, and a flow rate (G) of the air supplied to the wire tensioner (40) is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire (18).

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

To provide a wire bonding method and a wire bonding device capable of stably forming a free air ball having a large ball diameter while suppressing oxidation of the free air ball, in addition to supply of an oxidation prevention gas from gas supply means (10) into an insertion portion (32), an oxidation prevention gas is supplied from a gas supply nozzle (40), which is arranged outside the insertion portion (32), so as to cover an inlet of the insertion portion (32). Under a state in which a leading end of a wire (74) is positioned inside the insertion portion (32), and in which a leading end of a capillary (3) is positioned outside the insertion portion (32), spark discharge is generated. With this, a free air ball (75) having a large ball diameter can be formed while suppressing oxidation of the free air ball (75) and stabilizing the free air ball (75).

A wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. The clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit. The capillary is fixedly installed on the third member and rotates in conjunction with the third member.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

[Problem] To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant. [Solution] The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a piezoelectric element (10) that is expanded and contracted along an axial direction of a bonding arm (3) with one end thereof fixed to a leading end of the bonding arm (3), a capillary holding portion (15) that is in contact with a circumferential face of a capillary (20) at a base end side thereof as being fixed to the other end of the piezoelectric element (10), a string-like member (23) that is wound to a half circumferential face of the capillary (20) at the base end side on a side opposite to the capillary holding portion (15), and a tension mechanism (25) that is arranged at the bonding arm (3) side to press and hold the capillary (20) to the capillary holding portion (15) by exerting tensile force on the string-like member (23).

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

A high-voltage energy storage module for supplying a voltage, in particular to a motor vehicle, includes at least two storage cells and at least one electrically conductive connection between two poles of different storage cells. The individual connection consists of multiple adjacently arranged bonding wires, and each bonding wire is secured to the two poles by means of a wire bonding.

A method of manufacturing a semiconductor device is provided. A bonding tool with a wire tail extending out of the tip thereof is lowered to bring the tip of the wire tail into contact with a bonding surface of the semiconductor device. Next, the bonding tool in a direction intersecting with the axial direction of the bonding tool (Z direction) is moved to bend the wire tail with the tip of the wire tail in contact with the bonding surface. Then the bonding tool is lowered to form the wire tail into a predetermined shape such that the tip of the wire tail points upward. And then, a wire looping step, a second bonding step and a wire cutting step are performed. This allows the wire tail to be formed easily and efficiently into a predetermined shape.

[Problem]

To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.

[Solution]

The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.