A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Provided is a stainless steel material for a diffusion bonding jig in which deformation of bonding members is suppressed while maintaining diffusion bonding properties of the bonding members, and in which releasability (detachability of a bonding member from a release member) after diffusion bonding treatment is excellent. An embodiment of the present invention provides a stainless steel material for a diffusion bonding jig having excellent deformation suppressibility and releasability, the material being a stainless steel material including 1.5 mass % or more of Si, and a ratio (Fr/Fp) of the high-temperature strength (Fr) of the stainless steel material at 1000 C. to the high-temperature strength (Fp) of a bonding member at 1000 C. being 0.9 or more, the bonding member to be bonded by diffusion bonding. The stainless steel material preferably includes C: 0.1 mass % or less, Si: 1.5 to 5.0 mass %, Mn: 2.5 mass % or less, P: 0.06 mass % or less, S: 0.02 mass % or less, Ni: 8.0 to 15.0 mass %, Cr: 13.0 to 23.0 mass %, and N: 0.2 mass % or less.

A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

A thermocompression apparatus includes a stage and a heater chip. The stage includes an installation surface on which a component having a scheduled portion of thermocompression is placed. The heater chip is disposed to be freely movable to and from the scheduled portion of thermocompression of the component opposite to the installation surface of the stage and is configured to heat and press the scheduled portion of thermocompression. The installation surface includes a maximum convex and a pair of slope surfaces. The maximum convex is configured to contact with a bottom surface of the component. The pair of slope surfaces has heights decreasing respectively from the maximum convex toward both sides of the installation surface in a width direction of the component.

To provide a heater chip which is excellent in energization heat generation characteristic of the ironing portion thereof, and which can efficiently and stably perform a joining process of joining a conducting thin wire to a terminal member. The heater chip comprises an ironing portion located at the lowermost position in a posture of a normal use mode and a pair of connection terminal portions and formed integrally with the ironing portion and extending symmetrically or asymmetrically upward from a left and a right ends of the ironing portion. The ironing portion has a cross-sectional area equal to or smaller than the cross-sectional areas of the connection terminal portions and on the path of a current flowing in the heater chip when energized. A concave portion is formed on one side face of the ironing portion. A thermocouple is attached to the back face of the ironing portion through a protrusion.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Designs and methods are provided for a hard armor structure comprising a symmetrical array of regularly shaped armor tiles, and a lattice structure comprising rigid cell walls surrounding each tile.

A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.