A laser cutting head associable to a machine tool comprises a collimating group to collimate a laser beam coming from a laser emitting apparatus, a focusing group to focus in a focal point the laser beam collimated, an optical element to receive said laser beam focused and reflect a focused first portion thereof, and a wavefront sensor to receive said focused first portion of the laser beam, perform a phase measurement of a wavefront of said focused first portion, obtain a reconstructed wavefront on the basis of the phase measurement and send the reconstructed wavefront to an electronic processor; the electronic processor compares the reconstructed wavefront and a reference wavefront, determines one or more optical aberrations to which the laser beam is subjected, reduces such optical aberrations and changes said focal point.

The controller executes a first process of moving a support portion so that inside the peripheral edge of an object, a focusing position moves along the peripheral edge, thereby forming a first modified region, and following the first process, executes a second process of moving the support portion so that the focusing position moves, thereby forming a second modified region The measurement data acquiring portion, at execution of the first process, acquires measurement data associated with position information on a position of the object. The controller, at execution of the second process, causes the driving portion to shift a position of the condenser lens, the position being along the direction of an optical axis, to an initial position based on the measurement data acquired in the first process, before or when the focusing position moves from outside of the object to inside thereof.

Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.

A reflected beam detection value obtained by detecting a reflected beam of a visible beam generated on a sheet metal or a scattered beam detection value obtained by detecting a scattered beam from an optical component is stored in a storage unit, the reflected beam or the scattered beam being detected at a time when the sheet metal is cut by irradiating the sheet metal with a laser beam under a predetermined processing condition. The reflected beam detection value or the scattered beam detection value stored in the storage unit is registered as a reference value associated with the predetermined processing condition.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.

The invention relates to a method for collision avoidance of a laser machining head (102) in a machining space (106) of a laser machining tool (100), having the steps of: —Monitoring a workpiece (112) in the machining space (106) with at least one optical sensor; —Capturing images of the workpiece (112); —Detecting a change in an image of the workpiece (112); —Recognising whether the change comprises an object standing upright relative to the workpiece (112); —Checking for a collision between the upright object and the laser machining head (102) based on a predetermined cutting plan and/or the current position (1016) of the laser machining head; —Controlling the drives for moving the laser machining head (102) for collision avoidance in case of recognised risk of collision.

A scanned optical beam is divided so as to form a set of scanned subbeams. To compensate for scan errors, a portion of at least one subbeam is detected and a scan error estimated based on the detected portion. A beam scanner is controlled according to the estimated error so as to adjust a propagation direction of some or all of the set of scanned subbeams. The scanned subbeams with adjusted propagation directions are received by an f-theta lens and directed to a work piece. In typical examples, the portion of the at least one subbeam that is detected is obtained from the set of scanned subbeams prior to incidence of the scanned subbeams to the f-theta lens.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.