Systems and methods of adapting the geometrical shape of a laser beam in laser-based powder-bed fusion (PBF) are provided. An apparatus for laser-based powder-bed fusion includes a depositor that deposits a plurality of layers of a powder material. The apparatus further includes a laser beam source that generates a laser beam having a variable beam geometry. A laser application component applies the laser beam in one of a plurality of beam geometries to fuse the powder material to construct a build piece.

In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing.

A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.

The disclosed embodiments relate to the monitoring and control of additive manufacturing. In particular, a method is shown for removing errors inherent in thermal measurement equipment so that the presence of errors in a product build operation can be identified and acted upon with greater precision. Instead of monitoring a grid of discrete locations on the build plane with a temperature sensor, the intensity, duration and in some cases position of each scan is recorded in order to characterize one or more build operations.

A method of monitoring a heating operation on an component by a flame torch, including the steps of producing a flame with the flame torch, rotating the component with respect to the flame so that a circular weld is created on the component, and providing a first sensor that is operatively engaged with the component so that the first sensor monitors rotation or non-rotation of the components.

In a method for the manufacture of a transmissive optical system from a blank, material ablation is achieved on the blank with an ablative laser, and the pulse duration of the ablative laser is less than 1 ns, and preferably lies between 3 fs and 100 fs, or between 100 fs and 10 ps.

A laser assisted micromachining system, includes a working sliding, a tool module, a laser module, and a temperature control module for the processing of a workpiece. The laser module is disposed in the working slide and moves with the working slide in three-dimensional space. The temperature control module includes a temperature sensor, a cooler, a controller and a coolant, which detects the real-time temperature value of the cooler. The cooler is located in the working slide and supports the tool module. The controller controls the working state of the cooler according to the temperature feedback. Control signal induced by the temperature indicator, and the working state of the cooler are controlled by the controller. The coolant is used to control the temperature distribution of the cooler in the setting range. At the same time, the invention also provides a temperature control method for the laser assisted micro machining system.

An inspection method includes applying a laser beam to a semiconductor chip to reflow a bump disposed on a surface of the semiconductor chip and included in an irradiation range of the workpiece, the laser beam being applied from an opposite surface of the semiconductor chip, capturing an image of the irradiation range with use of a thermal camera while the laser beam is applied to the semiconductor chip, and acquiring temperature information regarding the semiconductor chip from the captured image, storing in advance reference temperature information that represents temperature information obtained when the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, and determining whether or not the semiconductor chip and the board have normally been bonded to each other by the laser beam applied thereto, on the basis of the reference temperature information and the temperature information.

A process is provided for the continuous production of thin-walled, radially closed hollow profiles composed of nonferrous metals and having a small cross section comprises supply of a flat strip of the metal to a forming apparatus at a first supply speed, the thickness of the strip corresponding to the wall thickness of the hollow profile. The forming apparatus continuous forms the flat strip into a shape corresponding to the hollow profile. After forming, two opposite edges of the flat strip rest flush against one another in a contact region and are continuously welded by means of a laser which emits light having a wavelength of less than 600 nm. The laser heats an area in a welding region having a diameter of less than 20% of the cross-sectional dimension of the hollow profile. The welded hollow profile is taken off from the welding region and taken up in an uptake device.