B23K26/034

Apparatus including laser heating for etching thin layer
11772198 · 2023-10-03 · ·

A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.

Additive manufacturing apparatus

An NC device that is a numerical control device controls an additive manufacturing apparatus. The additive manufacturing apparatus performs modeling by application of a melted material. The NC device includes a monitoring unit that monitors occurrence of a drop caused by a material after being melted remaining on the material before being melted, and a command generating unit that generates commands for causing the additive manufacturing apparatus to remove the drop that has occurred.

Additive manufacturing process

A system and method of monitoring a powder-bed additive manufacturing process is provided where a layer of additive powder is fused using an energy source and electromagnetic emission signals are measured by a melt pool monitoring system to monitor the print process. The measured emission signals are analyzed to identify outlier emissions and clusters of outliers are identified by assessing the spatial proximity of the outlier emissions, e.g., using clustering algorithms, spatial control charts, etc. An alert may be provided or a process adjustment may be made when a cluster is identified or when a magnitude of a cluster exceeds a predetermined cluster threshold.

Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus

A laser processing apparatus and a laser processing method that can effectively prevent a processing time for one semiconductor film from increasing are provided. A laser processing apparatus (1) according to an embodiment includes a laser light source (2) configured to irradiate a semiconductor film (M1) with a laser beam, a film state measuring instrument (5) configured to measure a state of the semiconductor film after the semiconductor film (M1) is irradiated with the laser beam, and a laser light adjusting mechanism configured to adjust a timing at which the semiconductor film (M1) is irradiated with a next laser beam and intensity of the laser beam according to the state of the semiconductor film (M1) measured by the film state measuring instrument (5).

SUBSTRATE TREATING FACILITY AND SUBSTRATE TREATING METHOD

The present invention provides a substrate treating facility, including: a process chamber including an annular beam emitting unit which emits an annular laser beam to a substrate and heats the substrate; and a laser beam generator configured to generate the laser beam emitted to the substrate through the annular beam emitting unit of the process chamber.

Multi zone spot heating in EPI

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

Laser soldering device and laser soldering method

A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

LASER STITCH WELDING DEVICE AND WELDING METHOD THEREFOR
20220274201 · 2022-09-01 ·

A laser stitch welding device, comprising: a laser welding assembly (3) configured to release laser beams from a front surface onto plates (5) to be welded that are stacked; a pressing piece (2) for adjusting a spacing between the stacked plates; detecting assembly for detecting a welding parameter of the stacked plates from a back surface; and a controller (1) for adjusting in real time the pressing level of the pressing piece (2) and/or operation parameters of the laser welding assembly (3) based on the welding parameter detected by the detecting assembly. The laser stitch welding device is capable of detecting in real time welding parameters such as back surface temperature and thermal infrared image of welding seams (6) when welding the plates. A control system controls the pressing level of the pressing piece or the operation parameters of the laser welding assembly based on the welding parameters to adjust the welding in a timely manner, thus achieving adaptive and stable control of weld penetration. The present application further provides a welding method for the laser stitch welding device.

Apparatus and method for additive manufacturing by ultra-high-speed laser cladding

The present invention relates to an apparatus and method for additive manufacturing by ultra-high-speed laser cladding. The apparatus includes a laser generator, a beam expander, and a reflector. A light exit path of the reflector is arranged facing a cladding nozzle. The cladding nozzle is connected to a powder pool through a hose and a pump in succession. A matrix is arranged below the cladding nozzle. The matrix is located on a rotary platform. A main stepping motor is fixedly mounted below the rotary platform. The main stepping motor is fixed on a lifting platform. A laser rangefinder is arranged above the matrix. During the laser cladding-based additive manufacturing process, the ultrasonic vibration device, the infrared camera, the high-speed camera, the laser rangefinder, and the radiological inspection system are turned on to monitor the laser cladding process in real time.

Method for the generative production of a component, device for performing the method and motor vehicle

The invention relates to a method for the generative production of at least one component, a device for performing the method and a motor vehicle, in particular a passenger car. In a method for the generative production of at least one component, a powder of a material is irradiated by means of laser radiation so that it is heated and at least partially melted and the molten material solidifies in order to at least partially form the component. Information relating to the temperature of the material irradiated and/or to be irradiated, in particular thermal radiation, is detected and used for influencing the laser intensity. The laser radiation is conducted at least in sections by means of a light guide to the material and the information relating to the temperature is transmitted in the inner region of the light guide for the purpose of its detection.