The invention relates to a device (1) for manufacturing a part (100) made of metallic material, comprising a depositing member (2) made of said metallic material. The device (1) further comprises an impacting member (4) of the material being deposited by emitting an energy beam (5), so as to locally modify its crystalline structure.

The present disclosure relates to a high-precision and high-efficiency laser polishing method oriented to a large-size ultra-thin mask plate, and belongs to the technical field of advanced laser manufacturing. A high-precision and high-efficiency laser polishing technology is applied to the surface smoothness improvement of the large-size ultra-thin mask plate. The high-precision and high-efficiency laser polishing method specifically comprises the four following steps: step one, selecting and placing an ultra-thin invar alloy mask plate on a five-axis machining platform; step two, adopting a nanosecond continuous laser, and setting a laser incident angle; step three, setting N laser polishing areas; and step four, performing laser polishing continuous splicing. Compared with the prior art, the surface smoothness of the mask plate is improved, the polishing efficiency is high, the precision is high, and the influence on the geometrical characteristic size of the appearance of an original mask plate is low.

A laser processing apparatus includes a laser beam applying mechanism for applying a laser beam to a workpiece held by a holding mechanism while keeping a converged spot of the laser beam in the workpiece, and a temperature detector for detecting a temperature of the holding mechanism or a temperature of an actuator of a moving mechanism that moves the holding mechanism in a processing feed direction. The laser beam applying mechanism has a converged spot position adjusting unit. The controller, depending on a temperature change detected by the temperature detector, controls the converged spot position adjusting unit to establish a position of the converged spot of the laser beam in a thicknesswise direction of the workpiece.

A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

A method of handling a test pad and a method of fabricating a semiconductor device are disclosed. The method of handling a test pad includes: providing a substrate formed thereon with a first insulating dielectric layer and a first test pad in the first insulating dielectric layer, wherein a surface of the first test pad is at least partially exposed from the first insulating dielectric layer, and there is a probe mark with a protrusion resulting from testing with probe tips on the surface portion of the first test pad exposed from the first insulating dielectric layer; and heating and melting the protrusion by laser annealing, thereby reducing a height of the protrusion. This invention can ensure good flatness of a surface to be bonded while enabling reduced process complexity and preventing metal contamination of the surface to be bonded.

The invention relates to a method for producing a three-dimensional component by an electron-beam, laser-sintering or laser-melting process, in which the component is created by successively solidifying predetermined portions of individual layers of building material that can be solidified by being exposed to the effect of an electron-beam or laser-beam source (2) by melting on the building material, wherein thermographic data records are recorded during the production of the layers, respectively characterizing a temperature profile of at least certain portions of the respective layer, and the irradiation of the layers takes place by means of an electron beam or laser beam (3), which is controlled on the basis of the recorded thermographic data records in such a way that a largely homogeneous temperature profile is produced, wherein, to irradiate an upper layer, a focal point (4) of the electron beam or laser beam (3) is guided along a scanning path (17), which is chosen on the basis of the data record characterizing the temperature profile of at least certain portions of the layer lying directly thereunder or on the basis of the data records characterizing the temperature profiles of at least certain portions of the layers lying thereunder.

Methods for determining the quality of a weld of a workpiece welded by laser-beam welding, wherein at least a partial region of a molten pool and/or of a surrounding area of the molten pool is observed by means of a measuring system during the laser-beam welding and the quality of the weld of the welded workpiece is determined on the basis of the observation result. At least one characteristic value that correlates with molten pool oscillation of the molten pool is observed during the laser-beam welding and a measure of an amplitude of the molten pool oscillation and/or a measure of a frequency of the molten pool oscillation is determined from the observed time curve of the characteristic value. A probability and/or a frequency for the occurrence of hot cracks at the weld of the workpiece is inferred.

In various embodiments, a workpiece is processed utilizing one or more output beams emitted from a step-core optical fiber and formed from one or more input beams that may have non-circular beam shapes. In various embodiments, an input beam may be a variable-power laser beam having a laser-beam numerical aperture (NA) that varies as a function of the power of the laser beam. The step-core optical fiber may have an outer core NA that is greater than or equal to the laser-beam NA at a laser power of approximately 100%, an inner core NA that is less than or equal to the outer core NA, and an inner core NA that is greater than or equal to the laser-beam NA at a power of 50%.

There is described a method of laser-processing a metal workpiece. The method generally has a step of laser-hardening a portion of the metal workpiece by momentarily exposing said portion to an out-of-focus region of a pulsed laser beam, the exposed portion heating to a given temperature and quenching thereafter, the sequence of said heating and said quenching thereby hardening said exposed portion, and a step of laser-cleaning the hardened portion by momentarily exposing said hardened portion to an in-focus region of said pulsed laser beam, thereby cleaning said hardened portion.

According to an example, an apparatus may include a heating lamp to illuminate and heat an area of a layer of build materials, in which the build materials may be one of a metallic and a plastic powder. The apparatus may also include a laser source to generate a laser beam and a controller to control the heating lamp to heat the build materials in the area of the layer of build materials to a temperature that is between about 100° C. to about 400° C. below a temperature at which the build materials begin to melt and to control the laser source to output a laser beam to melt the build materials in a portion of the heated area of the layer of build materials.