A combined optical system for determining temperature of the surface of an object or material and its distance with respect to a predetermined reference point associated with the system includes an optical radiation source emitting optical probe radiation at a predetermined wavelength or in a predetermined wavelength range, a source control unit controlling switching of the source from an operative condition, in which it emits optical probe radiation, to an inoperative condition, in which it does not emit optical probe radiation, optical detectors acquiring scattered optical radiation and thermally emitted optical radiation from the surface of the object or material, and a processing unit determining the distance of the surface of the object/material based on scattered optical probe radiation when the source is operative, and the local temperature of the surface of the object/material on the basis of thermally emitted optical radiation when the source is inoperative.

The present invention provides a device and method for electromagnetic induction heating-assisted laser additive manufacturing of a titanium matrix composite and belongs to the technical field of laser additive manufacturing. The device includes a coaxial-powder feeding laser deposition system and an electromagnetic induction heating synchronous auxiliary system. The coaxial-powder feeding laser deposition system includes a substrate, a deposition sample, a laser head and an infrared thermometer. The electromagnetic induction heating synchronous auxiliary system includes an electromagnetic induction power supply auxiliary unit, a coil, a steering heightening mechanism, a driven shaft and a transverse sliding groove. The coil is connected to an output end of the electromagnetic induction power supply auxiliary unit. The coil and the laser head do synchronous movement to implement small-area real-time preheating and slow cooling on the deposition sample.

A detection mechanism of a detection device includes a pulsed laser oscillator that emits a pulsed laser beam; an fθ lens facing a workpiece held by a chuck table; a thermal excitation section that applies the pulsed laser beam emitted from the pulsed laser oscillator to an upper surface of a wafer through the fθ lens and generates an ultrasonic wave propagated in a spherical form by thermal excitation; and an image forming section that forms an image by capturing a reflected laser beam influenced by vibration of the ultrasonic wave generated by the thermal excitation section, propagated through the inside of the workpiece, reflected by a lower surface of the workpiece, and returned to the upper surface of the workpiece, by an aperture synthesis method.

Systems and methods are provided for thermal inspection of tape layup. One embodiment is a method for performing inspection of a tape layup. The method comprises laying up tape onto a surface of a laminate, applying heat to tack the tape to the surface, and generating thermographic images of the tape as applied to the surface.

A method of processing by controlling one or more beam characteristics of an optical beam may include: launching the optical beam into a first length of fiber having a first refractive-index profile (RIP); coupling the optical beam from the first length of fiber into a second length of fiber having a second RIP and one or more confinement regions; modifying the one or more beam characteristics of the optical beam in the first length of fiber, in the second length of fiber, or in the first and second lengths of fiber; confining the modified one or more beam characteristics of the optical beam within the one or more confinement regions of the second length of fiber; and/or generating an output beam, having the modified one or more beam characteristics of the optical beam, from the second length of fiber. The first RIP may differ from the second RIP.

In a cryogenic workbench, a cryogenic laser peening system and a control method. A a tapered surface gap d is adjusted, based on the electromagnetic principle, to control the gasification volume of liquid nitrogen, then the temperatures of the copious cooling workbench and the surface of a sample are precisely controlled by means of the adjustment of the heat absorption amount of liquid nitrogen gasification, the temperature adjustment range and the temperature rising/lowering rate of the cryogenic laser peening system are effectively extended, and the precision of the control of the surface temperature of the sample is increased in combination with a closed-loop control. Additionally, an intelligent control of a cryogenic laser peening process is realized by means of a computer and a PLC control unit, whereby the usage amount of liquid nitrogen in the experiment process is reduced and the processing efficiency is improved.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

The disclosed embodiments relate to the monitoring and control of additive manufacturing. In particular, a method is shown for removing errors inherent in thermal measurement equipment so that the presence of errors in a product build operation can be identified and acted upon with greater precision. Instead of monitoring a grid of discrete locations on the build plane with a temperature sensor, the intensity, duration and in some cases position of each scan is recorded in order to characterize one or more build operations.

Methods and systems for detecting weld defects, and methods for manufacturing vehicles using such methods or systems, are provided. An exemplary method includes receiving an input indicating a weld material and material thickness by a portable computing device and determining, with the portable computing device, a detection protocol for the weld material and material thickness. Further, the method includes communicating the detection protocol from the portable computing device to a portable heating source and to a portable thermographic sensor, heating a weld with the portable heating source according to the detection protocol, and recording thermographic data from the weld with the portable thermographic sensor according to the detection protocol. Also, the method includes communicating the thermographic data from the portable thermographic sensor to the portable computing device, and analyzing the thermographic data to detect whether the weld includes a defect and/or determine type, dimension and location of the defect.