A laser bonding apparatus, a method of bonding a plurality of semiconductor devices arranged on a main substrate of a workpiece, to the main substrate, and a method of manufacturing a semiconductor package, the laser bonding apparatus including a chamber having a transmissive window and in which a workpiece is accommodatable; a gas supply conduit connected to the chamber and configured to supply a gas at an elevated pressure relative to a pressure outside of the chamber; and a laser generator arranged outside the chamber and configured to irradiate the workpiece accommodated in the chamber, through the transmissive window.

A laser power control device includes a storage unit that stores relational data having a measurement value of a heat radiation sensor, which measures intensity of heat radiation of an irradiation object irradiated with a laser beam from a laser machining device in association with a power value of the laser beam on a machining surface of the laser machining device.

A laser assisted micromachining system, includes a working sliding, a tool module, a laser module, and a temperature control module for the processing of a workpiece. The laser module is disposed in the working slide and moves with the working slide in three-dimensional space. The temperature control module includes a temperature sensor, a cooler, a controller and a coolant, which detects the real-time temperature value of the cooler. The cooler is located in the working slide and supports the tool module. The controller controls the working state of the cooler according to the temperature feedback. Control signal induced by the temperature indicator, and the working state of the cooler are controlled by the controller. The coolant is used to control the temperature distribution of the cooler in the setting range. At the same time, the invention also provides a temperature control method for the laser assisted micro machining system.

A method of processing by controlling one or more beam characteristics of an optical beam may include: launching the optical beam into a first length of fiber having a first refractive-index profile (RIP); coupling the optical beam from the first length of fiber into a second length of fiber having a second RIP and one or more confinement regions; modifying the one or more beam characteristics of the optical beam in the first length of fiber, in the second length of fiber, or in the first and second lengths of fiber; confining the modified one or more beam characteristics of the optical beam within the one or more confinement regions of the second length of fiber; and/or generating an output beam, having the modified one or more beam characteristics of the optical beam, from the second length of fiber. The first RIP may differ from the second RIP.

The present invention keeps a residual stress small which may occur in a metal shaped object (MO) while keeping a time short which is to be taken for carrying out main heating and preheating. An irradiation device (13) carries out a first heating step of heating a powder bed (PB) with laser light (LL) so that a temperature (T) of the powder bed (PB) is higher than 0.8 times as high as a melting point (Tm) of the metal powder and a second heating step of heating the powder bed (PB) with cladding light (CL) before or after the first heating step so that a temperature (T) of the powder bed (PB) is 0.5 times to 0.8 times as high as the melting point (Tm) of the metal powder.

A computing device for controlling the operation of an additive manufacturing machine comprises a memory element and a processing element. The memory element is configured to store a three-dimensional model of a part to be manufactured, wherein the three-dimensional model defines a plurality of cross sections of the part. The processing element is in communication with the memory element. The processing element is configured to receive the three-dimensional model, determine a plurality of paths, each path including a plurality of parallel lines, determine a radiation beam power for each line, such that the radiation beam power varies non-linearly according to a length of the line, and determine a radiation beam scan speed for each line, such that the radiation beam scan speed is a function of a temperature of a material used to manufacture the part, the length of the line, and the radiation beam power for the line.

A method for generating a structured surface on a substrate includes analyzing a substrate surface of the substrate and selecting, as a function of a condition of the substrate surface, method parameters including focus diameter, pulse peak power, pulse energy, point spacing, pulse length, pulse spacing and/or pulse sequence. The method further includes generating, by partial ablation and partial deposition via treatment with an intensive pulsed laser beam, surface structures having dimensions in the sub-micrometer range such that a multi-scale surface structure in the sub-micrometer and micrometer range adapted to intrinsically inhomogeneous properties of the substrate surface in the sub-micrometer range is generated. The substrate is an inhomogeneous substrate.

An enhanced symmetric multicycle rapid thermal annealing process for removing defects and activating implanted dopant impurities in a III-nitride semiconductor sample. A sample is placed in an enclosure and heated to a temperature T.sub.1 under an applied pressure P.sub.1 for a time t.sub.1. While the heating of the sample is maintained, the sample is subjected to a series of rapid laser irradiations under an applied pressure P.sub.2 and a baseline temperature T.sub.2. Each of the laser irradiations heats the sample to a temperature T.sub.max above its thermodynamic stability limit. After a predetermined number of temperature pulses or a predetermined period of time, the laser irradiations are stopped and the sample is brought to a temperature T.sub.3 and held at T.sub.3 for a time t.sub.3 to complete the annealing.

An additive manufacturing apparatus and corresponding method for building an object by layerwise consolidation of material, where the apparatus includes a build enclosure containing a build support for supporting the object during the build, a material source for providing material to selected locations for consolidation, a radiation device for generating and directing radiation to consolidate the material at the selected locations and an acoustic sensing system. The acoustic sensing system may be arranged to detect acoustic signals generated in the build enclosure by consolidation of the material with the radiation. The acoustic sensing system may be a passive acoustic sensing system arranged to detect acoustic signals generated in the build enclosure that are indicative of at least one condition of the building process and/or the object.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.