A method for joining a modular hot gas component by welding and high-temperature soldering. In order to optimally join high-temperature components, a first component is plugged into pins of a second component, a soldering material is placed between the two components, and the pins of the second component are welded to the first component.

A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.

A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.

The disclosure relates to methods and apparatuses for controlling a cutting process in which a workpiece is cut by a high-energy beam. A process light signal is detected emanating from an interaction region of the high-energy beam with the workpiece in a first wavelength range (Δλ1), in which at least one metallic constituent (Fe, Cr) of the workpiece has at least one emission line, and in a second wavelength range (Δλ2), which differs from the first wavelength range, in which continuum radiation of the workpiece without emission lines is detectable. Vaporization of the at least one metallic constituent (Fe, Cr) is monitored on the basis of an intensity of the process light signal detected in the first wavelength range (Δλ1) and on the basis of an intensity of the process light signal detected in the second wavelength range (Δλ2).

Controlled manufacturing system suitable for controlling a method for manufacturing, repairing or resurfacing a part by deposition of material under concentrated energy, said controlled manufacturing system comprising: means for obtaining a three-dimensional digital model of the part; means for generating a manufacturing file for the part, based on the three-dimensional digital model of said part, to define manufacturing parameters of an additive manufacturing machine, said manufacturing parameters being associated with manufacturing instructions; means for generating a control file for the part to define control parameters of a control effector, said control parameters being associated with control instructions; analysis means for carrying out an analysis of the manufacturing file and the control file in order to determine if the manufacturing parameters and the control parameters can coexist during the simultaneous application of the manufacturing parameters to the additive manufacturing machine and the control parameters to the control effector; a control module comprising at least one communication channel for receiving and sending the manufacturing instructions to a polyarticulated manufacturing system suitable for supporting the additive manufacturing machine, and at least one communication channel for receiving and sending the control instructions to a polyarticulated control system suited to supporting the control effector, to manage simultaneously the additive manufacturing machine and the control effector.

Disclosed is a system for adding material by melting powder on a determined surface of a workpiece by means of a laser beam in order to construct a volume, the system comprising: -a laser beam emitting device, -a laser scanning head provided with at least two galvanometric mirrors and provided with a lens for focusing the reflected incident laser beam on the determined surface, the system comprising the laser scanning head being held stationary relative to the workpiece while the volume is constructed, -a powder injection device positioned laterally relative to the focused reflected incident laser beam in order to distribute the powder on the determined surface, -the powder is melted by the focused reflected incident laser beam emitted on the powder distributed on the determined surface.

The present disclosure relates to a manufacturing system for additive manufacturing of a workpiece and an additive manufacturing method. The manufacturing system for additive manufacturing of a workpiece includes a building panel, a lifting device for the building panel, a blade device, an optical device, and a control unit. The blade device comprises at least one coater element for applying or removing a powder material to the building panel. The optical device comprises an optical element for reception of image data from the building panel and/or from the powder layer. The lifting device is configured to raise and/or lower the building panel. The control unit is configured to control the lifting device based on the image data.

Provided are a variable pulse width flat-top laser device and an operation method therefor. A variable pulse width flat-top laser device includes a light source unit including first and second laser light sources driven at different times to respectively emit pulse-type first and second laser beams, a beam shaping unit configured to shape the first and second laser beams emitted from the light source unit into flat-top laser beams, a combination/split unit located between the light source unit and the beam shaping unit, and including a first beam combination/split unit configured to combine optical paths of the first and second laser beams and split a combined optical path into at least two optical paths so that the split at least two optical paths are directed to different regions of an incident surface of the beam shaping unit, and an imaging optical system configured to time-sequentially overlay the flat-top laser beams shaped by the beam shaping unit on a target object to form an image.