B23K26/034

Advanced heating method and system

Herein discussed is a method of heating a material having a surface comprising exposing the surface to an electromagnetic radiation source emitting a first wavelength spectrum; receiving a second wavelength spectrum from the surface using a detector at a sampling frequency; wherein the first wavelength spectrum and the second wavelength spectrum have no greater than 10% of overlap, wherein the overlap is the integral of intensity with respect to wavelength. In an embodiment, the first wavelength spectrum and the second wavelength spectrum have no greater than 5% of overlap or no greater than 3% of overlap or no greater than 1% of overlap or no greater than 0.5% of overlap. In an embodiment, exposing the surface to the radiation source causes the material to sinter at least partially.

Processing machines and methods for heating a powder to produce three-dimensional components

The disclosure relates to processing machines and methods for producing three-dimensional components by irradiating powder with a processing beam, the machines including a container with a moveable support for the powder, as well as an irradiating device with a scanner device for aligning the processing beam on a processing field at an opening of the container. The irradiating device includes a heating device that includes a heating radiation source for generating a heating beam for heating the powder from above and including a beam shaping optical unit configured to convert a first beam profile of the heating beam into a second beam profile, e.g., a ring-shaped beam profile, of the heating beam.

Determining a Radiation Intensity and/or a Wavelength of Process Lighting
20230182233 · 2023-06-15 · ·

Various embodiments of the teachings herein include a method for determining a radiation intensity and/or a wavelength of a process light, wherein the melt pool underlying the process light can be generated by irradiating a metal material with an energy beam along a path, wherein the energy beam can be moved in accordance with a power profile along the path. The method may include: providing a power profile for a section of the path as an input variable for a machine learning model; training the model using historical and/or synthetic power profiles and associated historical or synthetic radiation intensities and/or wavelengths of the process light for the metal material; and determining the radiation intensity and/or the wavelength of the process light as an output variable of the model.

Laser processing method and laser processing apparatus

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

THERMAL RADIATION LIGHT DETECTION DEVICE AND LASER PROCESSING DEVICE

A thermal radiation light detection device includes: a housing including a plurality of wall portions; a light entrance unit attached to a wall portion and configured to cause thermal radiation light to enter the housing; a light extraction unit disposed inside housing and configured to extract light of a first wavelength and light of a second wavelength from the thermal radiation light, the second wavelength being different from the first wavelength; a first light detection unit attached to a wall portion and configured to detect the light of the first wavelength; a second light detection unit attached to a wall portion and configured to detect the light of the second wavelength; and a first temperature detection unit attached to a wall portion, the wall portion to which the first temperature detection unit is attached being different from the wall portion to which the first light detection unit is attached.

Temperature control system for additive manufacturing and method for same

The invention relates to a temperature control system for additive manufacturing and method for same. The temperature control system comprises: a cladding device configured to fuse a material and form a cladding layer, the cladding device comprising a first energy source; a micro-forging device coupled to the cladding device for forging the cladding layer; a detecting device; a control module; and an adjusting module coupled to at least one of the first energy source and the micro-forging device.

VISIBLE LASER ADDITIVE MANUFACTURING
20170341180 · 2017-11-30 · ·

A high resolution system for additive manufacturing, soldering, welding and other laser processing applications. A blue laser system for additive manufacturing, soldering, welding and other laser processing applications and operation for additive manufacturing of materials.

Turbocharger shaft and wheel assembly

A method can include co-axially locating a turbine wheel and a shaft where a force applicator applies an axially directed force to the turbine wheel, where the turbine wheel transfers at least a portion of the force to shaft and where a rotatable shaft collet supports the shaft; rotating the rotatable shaft collet; energizing at least one laser beam; and, via the at least one laser beam, forming a weld between the turbine wheel and the shaft.

Laser compression bonding device and method for semiconductor chip

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.

METHOD AND SYSTEM FOR WELD DEFECT DETECTION

Methods and systems for detecting weld defects, and methods for manufacturing vehicles using such methods or systems, are provided. An exemplary method includes receiving an input indicating a weld material and material thickness by a portable computing device and determining, with the portable computing device, a detection protocol for the weld material and material thickness. Further, the method includes communicating the detection protocol from the portable computing device to a portable heating source and to a portable thermographic sensor, heating a weld with the portable heating source according to the detection protocol, and recording thermographic data from the weld with the portable thermographic sensor according to the detection protocol. Also, the method includes communicating the thermographic data from the portable thermographic sensor to the portable computing device, and analyzing the thermographic data to detect whether the weld includes a defect and/or determine type, dimension and location of the defect.