Patent classifications
B23K26/034
SYSTEM FOR LASER BONDING OF FLIP CHIP
A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.
APPARATUS AND METHOD FOR DIRECT WRITING OF SINGLE CRYSTAL SUPER ALLOYS AND METALS
A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.
ACCURATE THREE-DIMENSIONAL PRINTING
The present disclosure provides three-dimensional (3D) printing methods, apparatuses, and systems using, inter alia, a controller that regulates formation of at least one 3D object (e.g., in real time during the 3D printing); and a non-transitory computer-readable medium facilitating the same. For example, a controller that regulates a deformation of at least a portion of the 3D object. The control may be in situ control. The control may be real-time control during the 3D printing process. For example, the control may be during a physical-attribute pulse. The present disclosure provides various methods, apparatuses, systems and software for estimating the fundamental length scale of a melt pool, and for various tools that increase the accuracy of the 3D printing.
Thermal processing by scanning a laser line beam
The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.
LASER MACHINING METHOD AND LASER MACHINING APPARATUS
A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.
TELEOPERATED ROBOT FOR FLOOD-WELDING OPERATIONS
A remote controlled, tele-operated welder includes a multi-axis robot arm, video cameras, sensors a specialized control station that allows an operator to perform flood-fill welding operations at a remote location to avoid the heat, smoke and other environmental effects produced through typical flood-welding operations. The operator accesses the control unit (OCU) using a GUI and mouse, keyboard, joystick, or other custom controls, and observe the piece via the cameras (visual, thermal, or other) placed in the welding station via a feed displayed on the OCU display(s). Audio, video, and/or tactile feedback may be provided to indicate arm, welder, or other system status, for collision warning and arm motion singularity avoidance. Augmented reality informational graphic/textual overlays may provide guidance to an operator, and the apparatus may further include the ability to repeat series of steps needed to handle flood-weld on a given piece, repeatedly across many pieces.
SHAPED ARTICLE MANUFACTURING APPARATUS AND MANUFACTURING METHOD
A manufacturing apparatus additively shapes an article by sintering or melting and then solidifying a metal powder through irradiation of a shaping optical beam. The manufacturing apparatus includes: a chamber; a metal powder feeding device that feeds the metal powder to an irradiation area; a shaping optical beam irradiation device that applies the shaping optical beam to the metal powder in the irradiation area; an absorptance enhancement assisting unit that performs a predetermined absorptance enhancement assisting treatment on the metal powder; and a shaping unit that, following implementation of the absorptance enhancement assisting treatment, performs a shaping treatment of additively shaping the article by applying the shaping optical beam and thus heating the metal powder to sinter or melt and then solidify.
SYSTEM AND METHOD FOR SPATIALLY CONTROLLING AN AMOUNT OF ENERGY DELIVERED TO A PROCESSED SURFACE OF A SUBSTRATE
System for spatially controlling an amount of energy delivered to a processed surface of a processed substrate including a first area and a second area, the first area having a first combination of optical properties and thermal properties, and the second area having a second combination of optical properties and thermal properties, the first combination and second combination being different, the system including a light source configured to emit a pulsed light beam towards the processed surface, wherein the pulsed light beam delivers a first amount of energy onto the first area of the processed surface so that the first area reaches a first target temperature, and a second amount of energy to the second area of the processed surface so that the second area reaches a second target temperature. A corresponding method is also described.
ADDITIVE MANUFACTURING APPARATUS
An NC device that is a numerical control device controls an additive manufacturing apparatus. The additive manufacturing apparatus performs modeling by application of a melted material. The NC device includes a monitoring unit that monitors occurrence of a drop caused by a material after being melted remaining on the material before being melted, and a command generating unit that generates commands for causing the additive manufacturing apparatus to remove the drop that has occurred.
LASER PROCESSING DEVICE, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD
A laser processing system includes an irradiation device that irradiates a laser beam to a workpiece and includes a housing, a box positioned inside the housing and housing at least a part of a path of the laser beam, and at least one infrared sensor positioned inside the housing and around the box.