A laser cutting device, a control method and a control apparatus, the device comprising: a conveying mechanism (1) comprising a feeding end and a discharging end; a working platform (2) disposed at the discharging end of the conveying mechanism (1); a first counter (3) and a second counter (4) oppositely disposed at a side of the working platform (2) near the discharging end of the conveying mechanism (1) and driven respectively by two opposite side edges of a substrate (6) to rotate for counting; a laser cutter (5) disposed above the working platform (2); a control device (13) for determining a modified cutting motion path of the laser cutter according to a set cutting path, and starting and ending times of counting values of the first counter (3) and second counter (4), and for controlling the laser cutter to cut the substrate (6) according to the modified cutting motion path.

A galvanometric laser for cutting and/or etching textile embellishments such as transfers or applique's and a method of operation thereof that is capable of visually capturing an incoming graphic image and referencing a cut pattern to the captured image and dynamically adjusting the cut pattern during cutting, etching and/or application of energy from the laser to thereby compensate for distortions in the fabric. The device includes a conveyor with an imaging station at which the graphic product is indexed under a high-resolution static camera with color recognition capability for the purposes of image capture. A high intensity bottoms-up light source resident at the imaging station provides ample illumination regardless of whether the design elements are face up toward the camera or face down toward the light source, or a combination of both. The system includes a computer at which the captured product image is analyzed, and the analytics are used to adjust the input cut file specifying the location and power settings for laser application. The product is then advanced in a controlled manner by means of the conveyor into a galvanometric cutting station where laser energy is applied. After completion the product is advanced out of the galvanometric cutting station for packaging.

Provided is a laser processing machine including a laser head capable of irradiating a workpiece with laser beam, a belt conveyor provided away in an irradiation direction of the laser beam, and a control unit configured to control operations of the laser head and the belt conveyor. The laser head is configured to be movable along at least a rotating direction of the belt conveyor. The control unit is configured to control, in a case where a moving direction and a moving speed of the laser head match the rotating direction and a rotating speed of the belt conveyor during the irradiation with the laser beam, the operation of at least one of the laser head and the belt conveyor in order to avoid the matching.

A laser engraving device includes a carrier substrate, a position detecting module, and a laser engraving module. The carrier substrate is used to carry at least one wafer, and the at least one wafer has a first engraving area formed thereon. The position detecting module includes a first transmitting component and a first receiving component. The laser engraving module includes a first laser generator to provide a first laser light source. The position detecting module can provide a first position signal of the first engraving area by matching the first transmitting component and the first receiving component. Therefore, the light from the first laser light source generated by the first laser generator can be precisely projected onto the first engraving area of the at least one wafer according to the first position signal so as to form a first predetermined pattern on the first engraving area.

A method controls an operation of a laser processing machine with redundant actuators including a first actuator and a second actuator. The method determines a feasible region for states of the first actuator and states of a reference trajectory of the first actuator defined by constraints of the laser processing machine, constraints on the reference trajectory and constraints on a range of motion of the second actuator. The method selects a subset of the feasible region, such that for any state of the first actuator and any state of the reference trajectory within the subset, there is an admissible control maintaining the state of the first actuator within the subset of the feasible region for admissible future states of the reference trajectory, and selects an admissible control action for controlling the operation such that the state of the first actuator remains in the subset of the feasible region.

Embodiments pertain to a system for controlling outputting of light towards objects, the system comprising a detection subsystem configured to detect, for at least one object, one or more values of object characteristics, the object characteristics comprising, at least, electromagnetic absorption characteristics, wherein detection of object characteristic values is performed such that the object remains structurally intact; a light source subsystem comprising at least one light source for generating output light and directing the output light towards an object; and a controller configured to control, based on the detected object characteristics values, at least one operational parameter value of the at least one light source such that at least some of the output light that is directed towards the object has electromagnetic characteristics that correspond to the detected values of the electromagnetic absorption characteristics of the object, in order to structurally change at least part of the respective object.

The disclosure relates to methods and apparatuses for controlling a cutting process in which a workpiece is cut by a high-energy beam. A process light signal is detected emanating from an interaction region of the high-energy beam with the workpiece in a first wavelength range (1), in which at least one metallic constituent (Fe, Cr) of the workpiece has at least one emission line, and in a second wavelength range (2), which differs from the first wavelength range, in which continuum radiation of the workpiece without emission lines is detectable. Vaporization of the at least one metallic constituent (Fe, Cr) is monitored on the basis of an intensity of the process light signal detected in the first wavelength range (1) and on the basis of an intensity of the process light signal detected in the second wavelength range (2).

A laser processing apparatus includes a light source, a laser head configured to emit a laser beam, a robot configured to move the laser head, and a control apparatus configured to control start and stop of generation of the laser beam and control operation of the robot. The control apparatus controls the light source to generate the laser beam when a first time has elapsed after causing the robot to start an operation of accelerating the laser head such that a movement speed of the laser head with respect to a processing target object reaches a constant target speed.

A method for aligning a scan laser beam on a wafer include scanning a scan laser beam across a laser beam sensor along a scan line, picking up a scan laser beam, at a first position, using a first optical slit of the laser beam sensor to generate a first electrical pulse, picking up the scan laser beam, at a second position, using a second optical slit of the laser beam sensor to generate a second electrical pulse, picking up the scan laser beam, at a third position, using a third optical slit of the laser beam sensor to generate a third electrical pulse, and determining a spot size and a position of the laser beam based on the first to third electrical pulses.

A method and system for aligning a scan laser beam on a wafer include scanning a scan laser beam across a laser beam sensor along a scan line, picking up a scan laser beam, at a first position, using a first optical slit of the laser beam sensor to generate a first electrical pulse, picking up the scan laser beam, at a second position, using a second optical slit of the laser beam sensor to generate a second electrical pulse, picking up the scan laser beam, at a third position, using a third optical slit of the laser beam sensor to generate a third electrical pulse, and determining a spot size and a position of the laser beam based on the first to third electrical pulses.