A pressing system for a laser joining system for pressing together parts to be joined (storage cell, base plate) in the area of a joining point, includes a receptacle for accommodating the parts to be joined, a pressing element for locally pressing together the parts to be joined, in the area of the joining point, and a positioning system for the relative positioning of the pressing element and the receptacle and for pressing together the parts to be joined, during the joining process. The positioning system includes a parallel positioning device for the relative positioning of the receptacle and the pressing element in parallel to a plane (E), and an oblique positioning device for the relative positioning of the pressing element and the receptacle obliquely, in particular transversely, with respect to the plane (E) and for pressing together the parts to be joined, during the joining process.

A production method for a bonding tool with a body that has an elongated tool shank of the bonding tool and a tool tip adjoining the tool shank, and with a blind hole that is provided in the region of an elongated tool shank of the bonding tool and that is carried into the region of a tool tip, wherein a contact surface of the bonding tool is provided on the tool tip, comprising the following production steps: first a through opening is produced that is carried through the tool shank to the tool tip; then the through opening is closed in the region of the tool tip by a terminating element inserted into the body.

A laser welding device includes: a gun body mounted on a front end portion of an arm of a robot; a laser scanner installed on the gun body; a shielding gun fixed to the gun body in a first direction and shielding a laser beam irradiated from the laser scanner; and a pressing gun installed at the gun body to move in the first direction or in a second direction perpendicular to the first direction.

An image forming apparatus includes an oscillator configured to oscillate a laser beam, an irradiation portion configured to radiate the laser beam oscillated by the oscillator to an outside, a light absorption unit configured to absorb the laser beam and to convert the laser beam to heat, and a control unit including at least one processor and at least one memory. The control unit is configured to control the irradiation portion to press the irradiation portion against a workpiece via the light absorption unit and irradiating the workpiece with the laser beam via the light absorption unit, so as to perform image forming processing.

A mask extension welding apparatus for thin film deposition to extend and weld a mask on a frame includes an extension unit configured to extend the mask in a first direction, a pressure unit configured to press the mask towards the frame, and a laser welding unit configured to weld the mask and the frame. The pressure unit includes an upper housing, a lower housing spaced apart from the upper housing with respect to a fluid inlet, and a porous plate disposed at a downstream of the fluid inlet, the porous plate connecting the upper housing and the lower housing, and configured to eject a fluid supplied through the fluid inlet towards the mask.

A spot welding jig is provided. The spot welding jig presses electrode leads of battery cells to be closely adhered onto a bus bar when spot welding is performed to the electrode leads interposed on the bus bar along a width direction of the electrode leads. The spot welding jig includes a passing portion through which a welding laser passes, and a predetermined number of barriers configured to vertically partition an inner space of the passing portion.

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

A tool configured for adjusting a plurality of pressing heads of an auxiliary welding machine and a method for operating the same are disclosed. The tool includes: a support; a limiting mechanism disposed on the support, wherein the limiting mechanism has a limiting groove for receiving a top end of at least one of the plurality of pressing head. It is possible to adjust the plurality of pressing heads of the auxiliary welding machine more conveniently and accurately using the above tool.

Provided are a welding apparatus having a reduced size. A welding apparatus includes a support base having a placement surface, and a restriction member. A substrate with a semiconductor element disposed thereon is placed on the placement surface such that a surface electrode of the semiconductor element faces upward. A wiring member is placed on the surface electrode. The restriction member restricts movement of the surface electrode and the wiring member in the directions away from each other, by holding the substrate with the semiconductor element disposed thereon and the wiring member, between the placement surface and the restriction member. The welding apparatus further includes a laser device. The laser device locally heats a welding interface between the surface electrode and the wiring member by irradiating a laser beam onto the surface of the wiring member through a hole in the restriction member.

A laser reflow apparatus reflows solder bumps disposed on a side of a semiconductor chip in a workpiece and included in an irradiation range on the workpiece by applying a laser beam to an opposite side of the semiconductor chip. The laser reflow apparatus includes a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of a laser beam emitted from a laser beam source, and an image focusing unit including an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece.