A handheld laser trimming and welding device can include a handheld laser trimming and welding wand and a nozzle. The nozzle can extend from the handheld laser trimming and welding wand to a distal portion, and the nozzle can have an aperture on the distal portion. The distal portion of the nozzle can be configured to optically communicate a laser to the distal portion of the nozzle and fluidically communicate a pressurized gas to the distal portion of the nozzle.

A system for cutting blanks is provided. The blanks include a first blank and a second blank. The system comprises an edge detector configured to determine a configuration of an edge of the first blank; a cutter configured to cut an edge of the second blank; and one or more processors operatively connected with the edge detector and the cutter, the one or more processors controlling the cutter to cut the edge of the second blank into a configuration based on the detected configuration of the edge of the first blank.

A jig used for welding a cylindrical battery, which is a jig for welding a collector plate electrically connected to an electrode assembly of a cylindrical battery cell to a battery can, may include: a main body configured to come into contact with the collector plate to press the collector plate and having a through-hole for welding; and a position determination portion coupled to at least one of both ends of the main body to come into contact with an end of the collector plate, and configured to cause the collector plate to be fixed at a correct position during welding. A method of manufacturing a cylindrical battery and cylindrical battery made by the method are also provided.

Provided is a laser processing device that enables a film to be stabilized and processed. The present invention comprises: a conveyance mechanism that conveys a film; a holding mechanism that has a pair of holding parts which can at least sandwich and hold lateral portions of the processing range of the film; and a laser mechanism for processing the processing range of the film held by the holding mechanism.

The invention relates to a method for producing modifications (9) in the interior of a solid body (1). The method comprises the introduction of laser radiation (14) of a laser (29) into the interior of the solid body (1) via a first surface (8) of the solid body (1). The solid body (1) forms a crystal structure. Modifications (9) are produced at predefined points in a production plane (4) in the interior of the solid body (1) by the laser radiation (14). The modifications (9) are closer to the first surface (8) than to a second surface, the second surface being parallel to the first surface (8). A plurality of linear forms (103) can be produced by the modifications (9). The solid body (1) cracks subcritically in the region of each modification (9). The subcritical cracks have an average crack length of less than 150 m orthogonally to the direction of longitudinal extent of the linear form in question. Modifications (9) that belong to the same linear form (103) and that are produced one after the other are produced at a distance from each other that is defined by the function (dx)/d<0.31, where x>d.

A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.