A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.

A laser irradiation apparatus includes a laser source configured to emit a laser beam to an object that is being conveyed to allow the object to be irradiated with the laser beam; a rotation detector configured to detect rotation of the object to obtain information on the rotation of the object; and circuitry configured to control laser irradiation onto the object based on the information on the rotation of the object.

The present invention relates to a laser material processing system for processing a workpiece by means of a laser beam, comprising an optical system having at least one optical component for focusing the laser beam to form a focal point on the workpiece or in a defined position relative to the workpiece, at least one inertial sensor for detecting a transitional and/or rotational acceleration of the at least one optical component of the optical system and/or the workpiece, and a processing unit connected to the at least one inertial sensor for determining a relative transitional and/or rotational acceleration between the focal point and the workpiece.

The present invention relates to a laser material processing system for processing a workpiece by means of a laser beam, comprising an optical system having at least one optical component for focusing the laser beam to form a focal point on the workpiece or in a defined position relative to the workpiece, at least one inertial sensor for detecting a transitional and/or rotational acceleration of the at least one optical component of the optical system and/or the workpiece, and a processing unit connected to the at least one inertial sensor for determining a relative transitional and/or rotational acceleration between the focal point and the workpiece.

A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.

A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

Systems and methods according to one or more embodiments are provided for forming canted holes in materials. In one example, a forming angle and a central axis for a vent through a panel is determined. A vent is formed in the panel about the central axis along the forming angle. The angled vent is formed with a circular shape at a first opening of the vent on a first surface of the panel when viewed at an angle perpendicular to the first surface of the panel. Additional systems and methods are also provided.

Systems and methods according to one or more embodiments are provided for forming canted holes in materials. In one example, a forming angle and a central axis for a vent through a panel is determined. A vent is formed in the panel about the central axis along the forming angle. The angled vent is formed with a circular shape at a first opening of the vent on a first surface of the panel when viewed at an angle perpendicular to the first surface of the panel. Additional systems and methods are also provided.

An invisible laser system and an optical path visualization method thereof are disclosed. The invisible laser system comprises an invisible laser light generator for generating invisible laser light; a visible light generator for generating visible light; and an optical path visualization component arranged in optical paths of the invisible and visible light, and comprising a first and second incident end and a first outgoing end. The invisible laser light is incident on the first incident end, and the visible light is incident on the second incident end. All of the invisible laser light and at least part of the visible light are emitted in parallel with each other at the first outgoing end. All of the invisible laser light is present in a direction parallel with the optical path of the visible light, and no invisible laser light is present in other directions, so radiation risks are eliminated.