The invention relates to methods for laser welding a first and a second workpiece portion with a laser beam that is guided using a laser machining head along a joining gap formed between the workpiece portions, in which method the laser beam is focused and a filler is lined up with the joining gap. At least one gap width of the joining gap of the workpiece portions to be welded is detected and evaluated along the course of the joining gap and compared with at least a first and a second gap measurement. If a detected gap width is within the first gap measurement, the feeding of the filler to the joining gap is stopped and a beam profile of the laser beam is set with a point or annular focus, and if a detected gap width is within the second gap measurement, a feeding of the filler is actuated.

The invention relates to methods for laser welding a first and a second workpiece portion with a laser beam that is guided using a laser machining head along a joining gap formed between the workpiece portions, in which method the laser beam is focused and a filler is lined up with the joining gap. At least one gap width of the joining gap of the workpiece portions to be welded is detected and evaluated along the course of the joining gap and compared with at least a first and a second gap measurement. If a detected gap width is within the first gap measurement, the feeding of the filler to the joining gap is stopped and a beam profile of the laser beam is set with a point or annular focus, and if a detected gap width is within the second gap measurement, a feeding of the filler is actuated.

The present invention relates to a method for joining a first blank and a second blank, wherein at least one of the first and second blanks comprises at least a layer of aluminum or an aluminum alloy. In particular, the method comprises placing the first and second blanks for welding; laser welding the first and second blanks following a welding path thus forming a tailor welded blank, wherein the welding path combines a linear movement along a welding direction and oscillating movements substantially transverse to the welding direction and then hot deforming and quenching the tailor welded blank to form a component, wherein the welding is done without using a filler.

The present invention relates to a method for joining a first blank and a second blank, wherein at least one of the first and second blanks comprises at least a layer of aluminum or an aluminum alloy. In particular, the method comprises placing the first and second blanks for welding; laser welding the first and second blanks following a welding path thus forming a tailor welded blank, wherein the welding path combines a linear movement along a welding direction and oscillating movements substantially transverse to the welding direction and then hot deforming and quenching the tailor welded blank to form a component, wherein the welding is done without using a filler.

Provided is a laser processing system with which correction of a control point can be carried out easily. This laser processing system is provided with a scanner capable of scanning a workpiece with laser light, a moving device for moving the scanner relative to the workpiece, and a scanner control device for controlling the scanner, wherein the scanner control device has a trajectory control unit for controlling the scanner such that the workpiece is irradiated with a control point correction trajectory for correcting a preset control point when the movement device is in a stopped state, and the control point correction trajectory has a prescribed length for specifying deviation of the laser light in the optical axis direction, and a prescribed shape for specifying the position of the control point and a direction of a coordinate system defined by the control point.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

A system for welding two pipes includes a first pipe clamp, a second pipe clamp, a weld torch, an inspection detector, a motor, one or more processors, and a grinder. The weld torch is configured to create a weld joint between the pipes at an interface region between the pipes. The inspection detector is configured to emit an inspection beam of radiation. The motor is operatively associated with the inspection detector to direct the inspection beam of radiation along the weld joint between the pipes. The one or more processors are operatively associated with the inspection detector to determine a profile of the weld joint between the pipes. The grinder is configured to grind at least a portion of the weld joint between the pipes based on the profile of the weld joint between the pipes.

A system for welding two pipes includes a first pipe clamp, a second pipe clamp, a weld torch, an inspection detector, a motor, one or more processors, and a grinder. The weld torch is configured to create a weld joint between the pipes at an interface region between the pipes. The inspection detector is configured to emit an inspection beam of radiation. The motor is operatively associated with the inspection detector to direct the inspection beam of radiation along the weld joint between the pipes. The one or more processors are operatively associated with the inspection detector to determine a profile of the weld joint between the pipes. The grinder is configured to grind at least a portion of the weld joint between the pipes based on the profile of the weld joint between the pipes.

A system for LAM that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object using a powder bed, wire feed, or direct deposition. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. These characteristics can be independently adjusted to control LAM characteristics including microstructure, mechanical and surface quality characteristics. The system may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing. This information can be used to adapt the material processing routine to improve LAM productivity and parts quality. The system also supports a variety of beam shaping methods that improve the quality of produced objects or mitigate processing issues.