An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a first modified region closest to a front surface of the semiconductor substrate and a second modified region closest to the first modified region. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating in the semiconductor substrate from the front surface side to the back surface side.

An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a first modified region closest to a front surface of the semiconductor substrate and a second modified region closest to the first modified region. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating in the semiconductor substrate from the front surface side to the back surface side.

Provided is a device for assembling a fuel supply pipe of which a joint portion between a pipe body and a short cylindrical member has a high strength and which has high anti-corrosion performance. Specifically, while a laser beam in a defocused state is being emitted to impinge on an end portion of the pipe body that overlaps the short cylindrical member, the pipe body and the short cylindrical member are rotated through one complete turn relative to the laser beam, thereby melting the entire periphery of the end portion. While the laser beam in a defocused state is being emitted to impinge on the melted end portion, the pipe body and the short cylindrical member are rotated through at least one further complete turn, thereby joining by welding the end portion to the outer periphery of the short cylindrical member.

For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

A device for aligning a processing optical assembly of a laser processing machine includes an entrance region for receiving a processing laser beam, a focus zone forming region for forming a measurement focus zone by the received processing laser beam along a target axis, and an imaging unit having a lens and a detector surface. The lens is configured to image measurement laser radiation that leaves the focus zone forming region after the measurement focus zone has been formed, along an imaging axis predefined by the target axis, onto the detector surface. The processing optical assembly is configured to shape a laser beam in the laser processing machine and to focus it along an incident beam axis so that a processing laser beam forms a preset Bessel beam focus zone in a workpiece to be processed.

A device for aligning a processing optical assembly of a laser processing machine includes an entrance region for receiving a processing laser beam, a focus zone forming region for forming a measurement focus zone by the received processing laser beam along a target axis, and an imaging unit having a lens and a detector surface. The lens is configured to image measurement laser radiation that leaves the focus zone forming region after the measurement focus zone has been formed, along an imaging axis predefined by the target axis, onto the detector surface. The processing optical assembly is configured to shape a laser beam in the laser processing machine and to focus it along an incident beam axis so that a processing laser beam forms a preset Bessel beam focus zone in a workpiece to be processed.

A workpiece processing method includes a first processing step of performing processing feeding with a focal point of a condenser lens positioned in the inside of a workpiece spaced from a front surface of a peripheral marginal area of the workpiece and processing the inside of the peripheral marginal area at a light concentrating point of a laser beam refracted by the front surface of the peripheral marginal area, and a second processing step of performing processing feeding with the focal point of the condenser lens positioned in the inside of the workpiece spaced from a front surface of a device area and processing the inside of the device area at the light concentrating point of the laser beam refracted by the front surface of the device area. In the first processing step, the focal point of the condenser lens is positioned outside the device area, and in the second processing step, the light concentrating point of the laser beam is formed outside the peripheral marginal area.