A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece.

A galvano scanner unit vibrates a laser beam when sheet metal is cut by irradiation of the sheet metal with the laser beam while a machining head is relatively moved with respect to the sheet metal. A focusing lens drive section moves a focal point of the laser beam with which the sheet metal is irradiated in an orthogonal direction orthogonal to a surface of the sheet metal. A focal position control section controls the focusing lens drive section to locate the focal point of the laser beam in a predetermined position in the orthogonal direction. A galvano control section controls the galvano scanner unit to change an amplitude with which the laser beam is vibrated, according to a position of the focal point in the orthogonal direction.

A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

For material processing of a material, which is in particular for a laser beam to a large extent transparent, asymmetric shaped modifications are created transverse to the propagation direction of the laser beam. Thereby, the laser beam is shaped for forming an elongated focus zone in the material, wherein the focus zone is such that it includes at least one intensity maximum, which is transverse flattened in a flattening direction, or a transverse and/or axial sequence of asymmetric intensity maxima, which are flattened in a sequence direction. After positioning the focus zone in the material, a modification is created and the material and the focus zone are moved relative to each other in the or across to the flattening direction or in the or across to the sequence direction for forming a crack along an induced preferred direction.

Systems and methods for additive manufacturing are described. In some embodiments, a method of controlling a weld height in an additive manufacturing process includes determining a desired melt pool width based, at least in part, on a desired weld height; selectively activating one or more laser energy sources based, at least in part, on the desired melt pool width; and melting a portion of a layer of material on a build surface via exposure to laser energy from the one or more activated laser energy sources to form a melt pool on the build surface having the desired melt pool width. Systems and methods to the use of staggered laser energy sources are also described.

Provided is a lens assembly. The lens assembly includes a first optical path offset assembly (33), a second optical path offset assembly (34), a drive mechanism, an elastic seal ring (35) and a locking mechanism (37). The optical path of the first optical path offset assembly and the optical path of the second optical path offset assembly communicate with each other. The first optical path offset assembly and the second optical path offset assembly are each rotatable about the central axis of the lens assembly (3). The drive mechanism is configured to drive the first optical path offset assembly to rotate about the central axis. The elastic seal ring is configured to make the first optical path offset assembly and the second optical path offset assembly rotate together. The locking mechanism is pressed against the first optical path offset assembly or the second optical path offset assembly to enable the first optical path offset assembly and the second optical path offset assembly to rotate relative to each other. The lens assembly enables an offset laser beam to be further offset or be rectified, and thereby the size of a light spot can be regulated in a more diversified manner and with a higher precision. Also provided is a laser welding head. The laser welding head includes the preceding lens assembly.

Provided is a lens assembly. The lens assembly includes a first optical path offset assembly (33), a second optical path offset assembly (34), a drive mechanism, an elastic seal ring (35) and a locking mechanism (37). The optical path of the first optical path offset assembly and the optical path of the second optical path offset assembly communicate with each other. The first optical path offset assembly and the second optical path offset assembly are each rotatable about the central axis of the lens assembly (3). The drive mechanism is configured to drive the first optical path offset assembly to rotate about the central axis. The elastic seal ring is configured to make the first optical path offset assembly and the second optical path offset assembly rotate together. The locking mechanism is pressed against the first optical path offset assembly or the second optical path offset assembly to enable the first optical path offset assembly and the second optical path offset assembly to rotate relative to each other. The lens assembly enables an offset laser beam to be further offset or be rectified, and thereby the size of a light spot can be regulated in a more diversified manner and with a higher precision. Also provided is a laser welding head. The laser welding head includes the preceding lens assembly.

A laser processing head is provided with: an optical component for splitting a laser light into a laser light and a laser light; a scanning unit for scanning the laser light; a light reception unit for detecting the intensity of the laser light; a second shutter that shifts between a closed position in which the laser light is blocked and an open position in which the laser light is transmitted; and a focal distance adjustment unit for adjusting the focal distance of the laser light. The second shutter is arranged between the optical component and the focal distance adjustment unit.