A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

The invention relates to a device (100) for an additive manufacture. The device (100) comprises a laser device (110) for machining material using a laser beam (112), said laser device (110) being designed to deflect the laser beam (112) onto a machining region of a workpiece (10); at least one supply device (130) for a supply material, said supply device being designed to supply the supply material to the machining region; and an interferometer (140) which is designed to measure a distance to the workpiece (10) by means of an optical measuring beam (142).

Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.

Laser welding device (1000) includes: laser oscillator (100); optical fiber (300) that transmits a laser beam (LB) generated in laser oscillator (100); laser beam emitting head (400) that is attached to the emission end of optical fiber (300) and emits laser beam (LB) toward workpiece (600); manipulator (500) with laser beam emitting head (400) attached thereto; and controller (200) that controls laser beam emitting head (400) so as to cause laser beam (LB) to be scanned three-dimensionally on the surface of workpiece (600). Controller (200) controls laser beam emitting head (400) so as to change a focal position of laser beam (LB) in accordance with a shape of a welded portion in workpiece (600).

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A method for determining local position of an optical element associated with an optical path for transporting a laser beam in a working head of a machine for laser processing a material, includes generating a measurement beam of low coherence optical radiation traveling a measurement optical path, leading the measurement beam towards the optical element and the reflected or diffused measurement beam towards an optical interferometric sensor arrangement, generating a reference beam of low coherence optical radiation traveling a reference optical path and leading the reference beam towards the interferometric optical sensor arrangement, superimposing the measurement and reference beams on a common region of incidence, detecting a position of a pattern of interference fringes between the measurement and reference beams, and determining a difference in optical length between the measurement and reference optical paths as a function of the position of the interference pattern along an illumination axis, or of the frequency of the interference pattern in the frequency domain.

A method for determining local position of an optical element associated with an optical path for transporting a laser beam in a working head of a machine for laser processing a material, includes generating a measurement beam of low coherence optical radiation traveling a measurement optical path, leading the measurement beam towards the optical element and the reflected or diffused measurement beam towards an optical interferometric sensor arrangement, generating a reference beam of low coherence optical radiation traveling a reference optical path and leading the reference beam towards the interferometric optical sensor arrangement, superimposing the measurement and reference beams on a common region of incidence, detecting a position of a pattern of interference fringes between the measurement and reference beams, and determining a difference in optical length between the measurement and reference optical paths as a function of the position of the interference pattern along an illumination axis, or of the frequency of the interference pattern in the frequency domain.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.