A method for slicing an ingot column is provided, including the following steps: immersing the column into a solution; rotating the column; focusing the rotating column with a focusing device; and using a laser device to cut the rotating column into sliced wafers. The slicing equipment of the present invention has a simple structure, easy operation, small kerf of the column, and fast slicing speed.

A method for slicing an ingot column is provided, including the following steps: immersing the column into a solution; rotating the column; focusing the rotating column with a focusing device; and using a laser device to cut the rotating column into sliced wafers. The slicing equipment of the present invention has a simple structure, easy operation, small kerf of the column, and fast slicing speed.

An optical system that relays light to a machining lens to be used for machining on a workpiece includes a spatial light modulator and a second lens arranged between the spatial light modulator and the machining lens, a distance D from the second lens to a machining lens pupil is D = f.sub.2 - Mf.sub.2, and a distance D1 from the spatial light modulator to the second lens is D1 = f.sub.2 - f.sub.2/M, and the spatial light modulator has a conjugate relation with the machining lens pupil of the machining lens, where f.sub.2 is a focal length of the second lens, and M is a projection magnification from the spatial light modulator to the machining lens pupil of the machining lens.

An apparatus for laser processing of very wide non-woven fabric materials at high speeds. This invention enables a laser beam to sever, perforate and pattern a large piece of fabric materials planarly disposed at regular or irregular spatial intervals over the entire width while the fabric passes from one roller to another roller at high speeds by precisely managing focus and intensity of the beam at the focal point on the web. A control system managing the laser processing system enables rapid reconfiguration of perforation patterns. The fabric can be woven or nonwoven, homogeneous or nonhomogeneous material with uniform or nonuniform thickness. An optical sensor is provided to sense the laser processing as it is performed and provide feedback to a system controller to optimize laser processing performance in real time.

Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

Methods of determining a polygon ablation pattern for use in mitigating one or more defects in an optical device are described. A method comprises identifying spatial coordinates of one or more defects areas in a first image of the optical device taken when tinted, defining a region of interest around at least one defect area of the one or more defect areas, and determining a polygon boundary around the at least one defect area in the region of interest to define the polygon ablation pattern.

Methods of determining a polygon ablation pattern for use in mitigating one or more defects in an optical device are described. A method comprises identifying spatial coordinates of one or more defects areas in a first image of the optical device taken when tinted, defining a region of interest around at least one defect area of the one or more defect areas, and determining a polygon boundary around the at least one defect area in the region of interest to define the polygon ablation pattern.

A laser device may include a first lens array including first lenses arranged in a first direction, a condenser lens disposed in a second direction intersecting the first direction of the first lens array and a first refractive index adjusting member disposed in a third direction opposite to the second direction of the first lens array.

A laser device may include a first lens array including first lenses arranged in a first direction, a condenser lens disposed in a second direction intersecting the first direction of the first lens array and a first refractive index adjusting member disposed in a third direction opposite to the second direction of the first lens array.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.