A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.

A laser processing apparatus irradiates a target with a laser light to form a modified region along a virtual plane in the target. The laser processing apparatus includes a support portion, an irradiation portion, a movement mechanism, and a controller. The controller performs a first processing process of irradiating a first portion in the target with the laser light under a first processing condition, and a second processing process of irradiating a second portion more on an inner side than the first portion in the target with the laser light under a second processing condition different from the first processing condition, after the first processing process.

In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing.

Optics assemblies and their methods of use in additive manufacturing systems are described. In some embodiments, an additive manufacturing system may include a build surface, a plurality of laser energy sources configured to produce a plurality of laser spots on the build surface, and an optics assembly configured to independently control a size of each of the plurality of laser spots and a spacing between the plurality of laser spots on the build surface. The optics assembly may include a plurality of lens arrays, where the plurality of lens arrays is configured to adjust a size of each of the plurality of laser spots on the build surface, and at least one lens. The at least one lens may also be configured to adjust a spacing between the plurality of laser spots on the build surface.

A method of forming a gas burner membrane. The method comprises forming a plurality of holes in a sheet of material. The holes are formed by laser cutting a required pattern of holes in the sheet of material.

A device for the laser treatment of trousers, including a laser beam generating equipment suitable for emitting the laser beam in any direction within an emission pyramid with an emission axis and two opening angles, and a work station with two mannequins, where each mannequin includes two legs. Each leg defines a longitudinal axis, and the two longitudinal axes of each mannequin define a mannequin plane. Each of the mannequins is oriented towards the equipment so that the emission axis strikes the mannequin plane at an angle of less than 90° and each mannequin has at least one of its legs within the pyramid.

A laser processing apparatus includes an irradiation portion, and a controller. The irradiation portion includes a shaping portion configured to shape the laser light. The controller includes: a determination portion configured to determine a first and a second orientation; a processing controller configured to perform a first process of forming the modified region along a first region and stopping formation of the modified region other than the first region, and a second process of forming the modified region along a second region and stopping formation of the modified region other than the second region; and an adjustment portion configured to adjust the orientation of the longitudinal direction to be the first orientation when the first process is performed, and to adjust the orientation of the longitudinal direction to be the second orientation when the second process is performed.

The subject-matter of the present invention is a method and an apparatus for collectively treating the surfaces of a plurality of objects.

A first laser irradiation, in which an amorphous silicon film is irradiated with a first laser beam for transformation of the amorphous silicon film to a microcrystalline silicon film, and a second laser irradiation, in which a second laser beam moves along a unidirectional direction with the microcrystalline silicon film as a starting point for lateral crystal growth of growing crystals constituting a crystallized silicon film, are carried out to form a microcrystalline silicon film and a crystallized silicon film alternately along the unidirectional direction.