B23K26/0604

LASER ABLATION MARKING SYSTEM FOR AND A METHOD OF PROVIDING AN IMAGE TO A WEB OF PACKAGING MATERIAL

A laser ablation marking system for providing an image to a web of packaging material is provided. The marking system includes at least one marking device having at least one laser having a plurality of individually controlled light outputs arranged in the cross-wise direction of the web of packaging material, each light output having a power output of at least 60 W and being configured to emit light to provide laser ablation, and a controller being connected to the marking device and configured to control the light outputs based on the speed of the web of packaging material such that the emitted light will always hit the web of packaging material at the same angle.

MULTI ZONE SPOT HEATING IN EPI

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

Apparatus for generating a line-shaped intensity distribution of a laser radiation
11105961 · 2021-08-31 · ·

An apparatus for generating a line-shaped intensity distribution of laser radiation comprises first and second beam transformation devices spaced apart from one another and at least one focusing element to focus laser radiation that has passed through the first and second beam transformation devices into a line-shaped intensity distribution. The apparatus is configured to change the line width of the line-shaped intensity distribution in a line transverse direction by changing a distance between the first and second beam transformation devices.

METHOD FOR SPLASH-FREE WELDING, IN PARTICULAR USING A SOLID-STATE LASER
20210260690 · 2021-08-26 ·

Laser beam welding a workpiece includes: generating first and second beam areas on the workpiece by first and second laser beams, respectively. The beam areas are guided in a feed direction relative to the workpiece. Centroids of the beam areas are not coinciding. The first beam area runs ahead of the second beam area. A length of the first beam area, measured transversely to the feed direction, is greater than or equal to that of the second. A surface area of the first beam area is greater than that of the second. A width of the first beam area, measured in the feed direction, is greater than or equal to that of the second. A laser power of the first laser beam is greater than that of the second. The second laser beam is irradiated into a weld pool generated by the first laser beam.

Apparatus for combining laser beams in optical fibers, and corresponding method

An apparatus comprises a multi-clad fiber that includes a light-guiding core surrounded by at least a cladding layer, and an input interface including a first set of input channels in the core configured to receive a first optical fiber, and a second set of input channels in the cladding layer configured to receive a second optical fiber. The apparatus further includes an optical switch module having an input port, a first and a second output port, a first optical path between the input port and the first input channel, and a second optical path between the input port and a second input channel in the second set of input channels. The optical switch module is controllable to switch between the first and the second optical paths. The apparatus also includes a set of laser modules.

THREE-DIMENSIONAL SHAPING METHOD AND THREE-DIMENSIONA LSHAPING DEVICE

The three-dimensional shaping device (100) is provided with a layer forming device (10) to form a layer of metal powder (90) on a shaping object, and a laser light irradiation device (20) to irradiate the layer of metal powder (90) formed by the layer forming device (10) with a laser light (25). The laser light (25) to be used in the three-dimensional shaping device (100) has a pulsed output waveform with a frequency of 5 to 200 kHz, a pulse width of 5 to 200 μs and a peak output of 10 to 500 W. Further, an overlap rate, which is a rate at which irradiation spots on the layer of metal powder (90) by two successive pulses of the laser light (25) overlap with each other, is 50 to 99.9%. Hereby, it is possible to provide a three-dimensional shaping method and a three-dimensional shaping device which can shape a shaping body having a narrower shaping width.

BUTT WELDING OF TWO WORKPIECES WITH AN ULTRASHORT PULSE LASER BEAM, AND ASSOCIATED OPTICAL ELEMENTS
20210276127 · 2021-09-09 ·

The present disclosure provides methods, devices, and systems for the butt welding of two, e.g., planar, workpieces, by at least one pulsed laser beam, e.g. an ultrashort pulse (“USP”) laser beam, which is focused into the workpiece material to locally melt the two workpieces in the region of their joining surface. The laser focus of the laser beam focused into the workpiece material is moved transversely with respect to the beam direction of the laser beam to produce in the region of the joining surface a weld seam extending transversely with respect to the beam direction of the laser beam.

Method for avoiding plume interference in additive manufacturing

A method of controlling an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes controlling at least one of: a trajectory of the one or more plumes, and the one or more energy beams, so as to prevent the one or more energy beams from intersecting the one or more plumes.

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
20210242010 · 2021-08-05 ·

A substrate processing system configured to process a substrate includes an eccentricity detection device configured to detect, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate; a modification layer forming device configured to form a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; and a periphery removing device configured to remove the peripheral portion starting from the modification layer.

METHOD FOR LASER-PROCESSING A SURFACE AND LASER PROCESSING SYSTEM
20210220944 · 2021-07-22 ·

There is described a method for laser-processing a surface. The method generally includes: directing, from a first viewpoint, a laser processing beam towards said surface including providing a focal point of said laser processing beam at a focal point position, resulting in illuminating said surface with a spot, while imaging said spot on said surface from a second viewpoint different from the first viewpoint; determining spatial coordinates of said surface based on calibration data and a feature of said imaged spot; and laser-processing said surface based on said previously determined spatial coordinates of said surface.