Herein discussed is a method of heating a material having a surface comprising exposing the surface to an electromagnetic radiation source emitting a first wavelength spectrum; receiving a second wavelength spectrum from the surface using a detector at a sampling frequency; wherein the first wavelength spectrum and the second wavelength spectrum have no greater than 10% of overlap, wherein the overlap is the integral of intensity with respect to wavelength. In an embodiment, the first wavelength spectrum and the second wavelength spectrum have no greater than 5% of overlap or no greater than 3% of overlap or no greater than 1% of overlap or no greater than 0.5% of overlap. In an embodiment, exposing the surface to the radiation source causes the material to sinter at least partially.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.

A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.

A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

To provide a clean bench that can prevent failure of optical components due to intrusion of dust and moisture, and enables to perform maintenance replacement of the optical unit, verification processes after replacement, etc. favorably, and a laser fiber oscillator mounting the same. A laser fiber oscillator includes a housing that accommodates an optical unit to be able to be drawn out; and a clean bench that is detachable to a side of the optical unit, and forms a closed space which is isolated from outside, above the optical unit that has been drawn out from the housing, in which a communication opening that is in communication with an internal space of the housing is formed in the clean bench.

A manufacturing method of a substrate, the method includes a crack forming process of forming a crack along an interface between a first portion of a processing object and a second portion of the processing object, the crack-forming process forming the crack in a manner that an ultrashort-pulse laser light is irradiated so that a focus point thereof is positioned at the interface or in a vicinity thereof, and a separating process of separating the processing object at the crack, wherein an impurity concentration of the first portion and an impurity concentration of the second portion are different from each other or material of the first portion and material of the second portion are different from each other.

A laser welding method is capable of easily restraining poor welding when spatters adhere to a protective glass of an optical system. The laser welding method includes a step of calculating a decrease-amount of the laser power before laser welding is performed by irradiating a welding portion of a workpiece with the laser beam having a predetermined power. The step of calculating the decrease-amount includes irradiating the welding portion with an inspecting laser beam having a power smaller than the predetermined power, receiving a return beam of the inspecting laser beam, measuring an intensity of the return beam, and comparing the intensity of the return beam with a standard intensity to calculate an amount of decrease in power of the inspecting laser beam at the welding portion.

A device is provide for operating a machine tool. The machine tool includes a rotation unit designed to rotate a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, the laser being arranged such that material of the workpiece is removed by means of the laser pulses. The device is configured to adjust the rotational speed progression based on geometry data of a specified geometry and/or a specified surface quality characteristic value representative of a corresponding surface quality.