A laser processing method includes a laser processing step of converging laser light to an object including a first surface and a second surface opposite to the first surface using the first surface as an incident surface to form a converging spot of the laser light, while relatively moving the converging spot with respect to the object, thereby performing laser processing in the object, the object being provided with a grinding planned area along the incident surface, and the laser processing step including a first forming step of relatively moving, while setting a position of the converging spot in a Z direction intersecting with the incident surface at a first Z position, the converging spot along a line extended in an X direction along the incident surface, thereby forming a first modified region and a first fracture extended from the first modified region in the object.

A laser processing method includes a laser processing step of converging laser light to an object including a first surface and a second surface opposite to the first surface using the first surface as an incident surface to form a converging spot of the laser light, while relatively moving the converging spot with respect to the object, thereby performing laser processing in the object, the object being provided with a grinding planned area along the incident surface, and the laser processing step including a first forming step of relatively moving, while setting a position of the converging spot in a Z direction intersecting with the incident surface at a first Z position, the converging spot along a line extended in an X direction along the incident surface, thereby forming a first modified region and a first fracture extended from the first modified region in the object.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

A workpiece separating device for irradiating a laminated body including a workpiece having a circuit substrate bonded with a supporting body via a separating layer with a light, thereby denaturing the separating layer, and peeling the supporting body from the workpiece, the workpiece separating device comprising: a holding member for detachably holding any one of the workpiece side or the supporting body of the laminated body; a light irradiation part for irradiating the light toward the separating layer through the other of the supporting body or the workpiece side of the laminated body held by the holding member; an isolation member for, with respect to any one of the workpiece side or the supporting body of the laminated body, isolating and moving the other in the thickness direction; and a controlling part for operation controlling the light irradiation part and the isolation member.

A workpiece separating device for irradiating a laminated body including a workpiece having a circuit substrate bonded with a supporting body via a separating layer with a light, thereby denaturing the separating layer, and peeling the supporting body from the workpiece, the workpiece separating device comprising: a holding member for detachably holding any one of the workpiece side or the supporting body of the laminated body; a light irradiation part for irradiating the light toward the separating layer through the other of the supporting body or the workpiece side of the laminated body held by the holding member; an isolation member for, with respect to any one of the workpiece side or the supporting body of the laminated body, isolating and moving the other in the thickness direction; and a controlling part for operation controlling the light irradiation part and the isolation member.

A method for material processing of a workpiece includes radiating a pulsed raw laser beam into an optical beam shaping system in order to form a quasi-non-diffractive laser beam with a focal zone extending in a longitudinal direction for the material processing of the workpiece. The optical beam shaping system is configured to impose a phase onto a beam cross section of the raw laser beam for forming phase-imposed laser radiation. The method further includes focusing the phase-imposed laser radiation into the workpiece so that the quasi-non-diffractive laser beam is formed and the focal zone has an intensity distribution that is adjustable along the longitudinal direction. The phase imposed on the beam cross section of the raw laser beam is set so that the intensity distribution of the quasi-non-diffractive laser beam in the focal zone is at least approximately constant in the longitudinal direction.