B23K26/062

MATERIAL PROCESSING UTILIZING HIGH-FREQUENCY BEAM SHAPING

In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

Method for manufacturing light-emitting element
11772202 · 2023-10-03 · ·

In a method for manufacturing a light-emitting element, a second irradiation process includes forming a first modified region at a first distance from a second surface in a thickness direction of a sapphire substrate, forming a second modified region at a second distance from the second surface in the thickness direction, the second distance being less than the first distance, the second modified region being shifted in a first direction from the first modified region, and forming a third modified region at a third distance from the second surface in the thickness direction, the third distance being less than the second distance, the third modified region overlapping the first modified region in a top-view. In the thickness direction of the sapphire substrate, a greater number of modified regions that include second modified portions are formed than modified regions that include first modified portions.

Method for manufacturing light-emitting element
11772202 · 2023-10-03 · ·

In a method for manufacturing a light-emitting element, a second irradiation process includes forming a first modified region at a first distance from a second surface in a thickness direction of a sapphire substrate, forming a second modified region at a second distance from the second surface in the thickness direction, the second distance being less than the first distance, the second modified region being shifted in a first direction from the first modified region, and forming a third modified region at a third distance from the second surface in the thickness direction, the third distance being less than the second distance, the third modified region overlapping the first modified region in a top-view. In the thickness direction of the sapphire substrate, a greater number of modified regions that include second modified portions are formed than modified regions that include first modified portions.

Laser processing apparatus and adjustment method for laser processing apparatus
11752574 · 2023-09-12 · ·

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator, a condenser lens that condenses a laser beam emitted from the laser oscillator, and a phase modulation element arranged between the laser oscillator and the condenser lens. Individual differences of the condenser lens are prevented by applying, to the phase modulation element, voltages corresponding to a combined pattern of a shape correction pattern which is configured to correct differences between an actual shape and design values of the condenser lens, and an adjustment pattern which is configured to adjust optical characteristics of the laser beam at each processing point.

ADDITIVE MANUFACTURE SYSTEM USING LIGHT VALVE DEVICE

An object build area is exposed to a radiation beam, such as a laser light source, which has been processed and controlled through a grating light valve or valves, or planar light valve, to thereby melt, sinter, fuse or cure predetermined portions of the build area corresponding to the equivalent of individually controlled pixels, with rapid movement and positioning of the resulting LV application output array on the build area. The LV arrangement is adapted to also generally heat an entire powder bed, or targeted areas of the bed, to just below melting temperature.

ADDITIVE MANUFACTURE SYSTEM USING LIGHT VALVE DEVICE

An object build area is exposed to a radiation beam, such as a laser light source, which has been processed and controlled through a grating light valve or valves, or planar light valve, to thereby melt, sinter, fuse or cure predetermined portions of the build area corresponding to the equivalent of individually controlled pixels, with rapid movement and positioning of the resulting LV application output array on the build area. The LV arrangement is adapted to also generally heat an entire powder bed, or targeted areas of the bed, to just below melting temperature.

LAYER CONSTRUCTION METHOD AND LAYER CONSTRUCTION DEVICE FOR ADDITIVELY MANUFACTURING AT LEAST ONE COMPONENT REGION OF A COMPONENT, AND COMPUTER PROGRAM PRODUCT AND STORAGE MEDIUM

The layer construction method comprises at least the following steps: a) applying at least one powder layer of a material to at least one construction and joining zone of at least one movable construction platform; b) locally solidifying the material to form a component layer, wherein the material is selectively scanned along scan lines by at least one energy beam and fused; c) lowering the construction platform layer by layer by a predefined layer thickness; and d) repeating the steps a) to c) until the component region is complete.

In step b), a distance h.sub.s between at least two central lines of neighboring scan lines in at least one component layer is adjusted in accordance with Formula I


0.85≤b.sub.smin/h.sub.s≤1.00  (I)

wherein b.sub.smin represents a minimum melt pool width of the scan lines.

Laser peening device and laser peening method

A laser peening device includes: a laser oscillator; an irradiation nozzle for irradiating a laser beam onto an irradiation target; an optical transmission unit; a shutter attached to the optical transmission unit; a liquid feeder for supplying the irradiation nozzle with liquid to cause the liquid to flow along an optical path of the laser beam running from the irradiation nozzle to the irradiation target; an ongoing irradiation sensor for obtaining information on ongoing laser beam irradiation indicating whether the laser beam is being appropriately irradiated for execution of ongoing laser peening operation on the irradiation target; and a control unit controlling the shutter according to the information on the ongoing laser beam irradiation obtained by the ongoing irradiation sensor.

Laser peening device and laser peening method

A laser peening device includes: a laser oscillator; an irradiation nozzle for irradiating a laser beam onto an irradiation target; an optical transmission unit; a shutter attached to the optical transmission unit; a liquid feeder for supplying the irradiation nozzle with liquid to cause the liquid to flow along an optical path of the laser beam running from the irradiation nozzle to the irradiation target; an ongoing irradiation sensor for obtaining information on ongoing laser beam irradiation indicating whether the laser beam is being appropriately irradiated for execution of ongoing laser peening operation on the irradiation target; and a control unit controlling the shutter according to the information on the ongoing laser beam irradiation obtained by the ongoing irradiation sensor.

METHOD OF REMOVING CONTAMINANTS FROM A DIFFUSION-COATED COMPONENT
20220288653 · 2022-09-15 ·

A method of removing contaminants from a surface of a gas turbine engine component protected by a diffusion coating that comprises an additive layer on the surface of the component and a diffusion zone in the surface of the component. The method includes subjecting the surface containing contaminants to laser beam pulses to remove contaminants from the component such that contaminants on the surface of the component are removed without damaging or removing the diffusion zone of the diffusion coating. Methods for controlled removal of at least a portion of a thickness of a diffusion coating from a coated superalloy component are also provided.