Patent classifications
B23K26/0665
F-theta lens and laser processing device for far-infrared laser processing
An Fθ lens and a laser processing device for far-infrared laser processing are provided. The Fθ lens for far-infrared laser processing comprises a first lens (L1), a second lens (L2) and a third lens (L3) which are coaxially arranged successively along a transmission direction of incident light beams, wherein the first lens is a negative meniscus lens, and the second lens and the third lens are positive meniscus lenses; and all the middle parts of the first lens, the second lens and the third lens protrude towards the transmission direction of incident light beams. The Fθ lens can improve the imaging quality and the resolution distance, effectively calibrate the astigmatism and distortion of the lens, reduce the influence of high-order aberrations, and has a high degree of energy concentration of laser focus points and high processing accuracy, thereby meeting the requirements for cutting or drilling. The Fθ lens is miniaturized, so that the volume of the lens is effectively controlled, and costs are reduced.
Laser material processing systems with beam positioning assemblies having fluidic bearing interfaces and associated apparatuses and methods
Laser material processing systems having beam positioning assemblies with fluidic bearing interfaces and associated systems and methods are disclosed herein. In one embodiment, a laser material processing system includes a beam positioning assembly configured to position a laser beam. The beam positioning assembly includes a first linear guide having first guide surfaces and a second linear guide having second guide surfaces. The first linear guide is moveably coupled to the first linear guide via the first guide surfaces. The second linear guide is moveably coupled to a carriage via the second guide surfaces. At least one fluidic bearing interface is positioned to prevent direct physical contact between the second linear guide and at least one of the first guide surfaces and/or between the carriage and at least one of the second guide surfaces.
LASER MACHINING METHOD AND LASER MACHINING APPARATUS
A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.
Laser cutting head for machine tool
A laser cutting head powered by a laser emission apparatus including optical transmission devices and associated with a cutting machine tool, includes a collimation device to collimate a laser beam coming from the laser emission apparatus, a focusing device to focus a collimated laser beam leaving the collimation devices, and a casing to house the focusing unit. The focusing unit includes one focusing lens and support devices to house and hold the focusing lens and move it along an adjustment direction within the casing in order to vary a focal point of the laser beam leaving the focusing lens. The laser cutting head includes a cooling unit secured to the casing and heat conducting devices used to connect the support devices with the cooling unit in order to extract the heat generated by the laser beam crossing the focusing lens by thermal conduction from the support devices and the focusing lens.
Machining Apparatus for Laser Machining a Workpiece and Method for Laser Machining a Workpiece
A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.
Self-retaining system having laser-cut retainers
Self-retaining suture systems including a suture thread bearing a plurality of laser-cut retainers are disclosed. A laser system allows the creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology.
Laser cladding method and device for implementing same
A method and device for laser cladding by independently heating the cladding material and the surface of the workpiece consist in formation of the series of parallel annular laser beams, possibly different wavelengths, with an adjustable distribution of laser radiation power across the annular beams. The annular beams are transformed into a series of conical beams which are separately focused along a single optical axis, along which the cladding material is fed. The device can be supplemented with a cylindrical mirror for the multipass laser radiation through the stream of cladding material with the possibility of the laser radiation return to the laser resonator.
METHOD FOR THE LASER WELDING OF A WORKPIECE, WITH BEAM SHAPING BY MEANS OF AN AXICON, AND OPTICAL APPARATUS
A method for laser welding of a workpiece includes providing a laser beam using a laser beam source, collimating the laser beam using a collimation optical unit, reshaping the collimated laser beam using a reshaping optical unit, and focusing the reshaped laser beam using a focusing unit. The focused laser beam is directed onto the workpiece to be welded. The reshaping optical unit has a first partial region in which at least one part of at least one axicon is embodied. At least a part of a beam cross-section of the collimated laser beam is directed onto the partial region of the reshaping optical unit.
Power control method for fiber laser processing machine, and fiber laser processing machine
There is provided a power control method for a fiber laser processing machine including: a fiber laser oscillator having a plurality of fiber laser modules each of which generates a laser beam; a laser processing head for emitting the laser beam generated from the fiber laser oscillator; and a condenser lens with a prescribed focal length provided between a workpiece and the laser processing head, for irradiating the workpiece with the laser beam having a spot diameter output from the laser processing head, wherein the number of the plurality of fiber laser modules oscillated is adjusted so as to achieve the spot diameter corresponding to the workpiece, and thereby, a beam quality from the laser processing head is adjusted.
Liquid-assisted laser micromachining systems and methods for processing transparent dielectrics and optical fiber components using same
The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.