B23K26/0665

LASER CUTTING HEAD WITH CONTROLLABLE COLLIMATOR HAVING MOVABLE LENSES FOR CONTROLLING BEAM DIAMETER AND/OR FOCAL POINT LOCATION
20220347792 · 2022-11-03 ·

A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for controlling the position of the movable collimator lenses. The lenses may be moved, for example, to adjust the beam spot size for cutting different types of material or material thicknesses. The lenses may also be moved to adjust a focal point back to the workpiece after changing the distance of the laser cutting head relative to the workpiece.

Processing device for forming pattern on surface of material by using diffraction of laser beam, and method thereof
11612961 · 2023-03-28 ·

A processing device to form a pattern on a surface of an object to be processed using diffraction of a laser beam emitted from a laser source, the device including: a main body providing a space to process the object using the laser beam emitted from the laser source; a laser transmission unit formed at a first portion of the main body, and configured to diffract the laser beam so that a diffracted laser beam is emitted toward the object; an actuator formed at a second portion of the main body, and connected to the laser transmission unit so as to change an emission pattern of the diffracted laser beam while rotating the laser transmission unit vertically/horizontally or in a set radius; and a controller provided at a third portion of the main body, and connected to the actuator to control an operation of the actuator.

Methods and systems for welding copper and other metals using blue lasers

A visible light laser system and operation for welding materials together. A blue laser system that forms essentially perfect welds for copper based materials. A blue laser system and operation for welding conductive elements, and in particular thin conductive elements, together for use in energy storage devices, such as battery packs.

SYSTEM AND METHOD FOR ADDING MATERIAL TO A DETERMINED SURFACE OF A WORKPIECE BY MEANS OF A LASER BEAM DIRECTED BY A LASER SCANNING HEAD AND LATERIAL POWDER INJECTION
20220347750 · 2022-11-03 ·

Disclosed is a system for adding material by melting powder on a determined surface of a workpiece by means of a laser beam in order to construct a volume, the system comprising: -a laser beam emitting device, -a laser scanning head provided with at least two galvanometric mirrors and provided with a lens for focusing the reflected incident laser beam on the determined surface, the system comprising the laser scanning head being held stationary relative to the workpiece while the volume is constructed, -a powder injection device positioned laterally relative to the focused reflected incident laser beam in order to distribute the powder on the determined surface, -the powder is melted by the focused reflected incident laser beam emitted on the powder distributed on the determined surface.

LASER PROCESSING MACHINE, LASER PROCESSING SYSTEM, ROTATOR UNIT APPARATUS, LASER PROCESSING METHOD, AND METHOD FOR PRODUCING PROBE CARD
20230092230 · 2023-03-23 · ·

A laser processing machine including: a laser source that emits a laser beam; a polarization rotator unit; a beam rotator unit; a lens; and a controller, which apply the laser beam to a workpiece, the polarization rotator unit includes a wave plate and first actuator that rotates the wave plate, the beam rotator unit includes an optical system that adjusts an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the lens at a position eccentric from a central axis, a second actuator rotates the optical system, the lens condenses the laser beam on the workpiece, the controller controls a rotational speed ratio between the first actuator and the second actuator, and adjusts a polarized state of the laser beam by controlling the rotational speed ratio.

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

A laser processing apparatus emits a laser light with a part of a focusing region being on an object to form a modified region along a virtual plane inside the object. The laser processing apparatus includes a support portion, an emission portion that emits the laser light onto the object, a moving mechanism that moves at least one of the support portion and the emission portion so that the part of the focusing region moves along the virtual plane inside the object, and a controller. The emission portion includes a shaping portion that shapes the laser light such that the shape of the part of the focusing region in a plane perpendicular to an optical axis of the laser light has a longitudinal direction. The longitudinal direction is a direction intersecting the direction of movement of the part of the focusing region.

METHODS OF FORMING A RAZOR BLADE ASSEMBLY
20220347875 · 2022-11-03 ·

A method of joining a razor blade to a blade support to form a razor blade assembly, the method including: directing a laser beam having an adjustable power output at an upper surface of the razor blade; and while advancing the laser beam along the razor blade: a) applying the laser beam at a first power output to the razor blade; b) reducing the first power output of the laser beam to a second power output; and c) applying the laser beam at the second power output to the razor to form a weld area joining the razor blade to the blade support. The weld area may be elongated and may include (i) a ratio of depth:width that is greater than about 2:1, and/or (ii) a ratio of length:width that is greater than about 5:1.

METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE
20220339740 · 2022-10-27 ·

A method of splitting a semiconductor work piece includes: forming a separation zone within the semiconductor work piece, wherein forming the separation zone comprises modifying semiconductor material of the semiconductor work piece at a plurality of targeted positions within the separation zone in at least one physical property which increases thermo-mechanical stress within the separation zone relative to a remainder of the semiconductor work piece, wherein modifying the semiconductor material in one of the targeted positions comprises focusing at least two laser beams to the targeted position; and applying an external force or stress to the semiconductor work piece such that at least one crack propagates along the separation zone and the semiconductor work piece splits into two separate pieces. Additional work piece splitting techniques and techniques for compensating work piece deformation that occurs during the splitting process are also described.

SYSTEM AND METHODS FOR FABRICATING A COMPONENT WITH LASER ARRAY

An additive manufacturing system includes a laser array including a plurality of laser devices. Each laser device of the plurality of laser devices generates an energy beam for forming a melt pool in a powder bed. The additive manufacturing system further includes at least one optical element. The optical element receives at least one of the energy beams and induces a predetermined power diffusion in the at least one energy beam.

Laser light radiation device and laser light radiation method

A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.