A processing system is a processing system that is configured to process an object by using an energy beam, and includes: an irradiation optical system that includes a condensing optical system and that is configured to condense the energy beam entering a pupil plane of the condensing optical system to irradiate the object with it; and a detection apparatus that is configured to detect, through the condensing optical system, an object light including a light from the object, at least a part of a path of the object light in the condensing optical system is different from at least a part of a path of the energy beam in the condensing optical system.

A gas supply device for a laser machining head is provided for generating a homogeneous gas flow. The gas supply device includes a gas inlet, a shared volume for superimposing a laser beam and the gas flow, and a gas channel system which, starting from the gas inlet, branches at least twice and connects the gas inlet with several outlet openings at the shared volume. The gas channel system and the outlet openings are configured to provide a substantially homogeneous gas flow to the shared volume.

A laser device may include a first lens array including first lenses arranged in a first direction, a condenser lens disposed in a second direction intersecting the first direction of the first lens array and a first refractive index adjusting member disposed in a third direction opposite to the second direction of the first lens array.

A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part. The controller controls the spatial light modulator so that a converging point of the 0th-order light in the Z direction is located on an opposite side of a converging point of non-modulated light of the laser light with respect to an ideal converging point of the 0th-order light.

A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in the X direction.

Laser device (100) includes first and second laser oscillators (1), (2) that respectively emit first and second laser lights (LB1), (LB2) having first and second wavelengths, and first and second optical systems (10), (20). First optical system (10) is configured to couple first and second laser lights (LB1), (LB2) to transmit the first and second laser lights to second optical system (20), and second optical system (20) is configured to condense first laser light (LB1) at first condensing position (FP1) and second laser light (LB2) at second condensing position (FP2). A maximum angle formed by an optical axis and an outermost component of first laser light (LB1) emitted from first optical system (10) is different from a maximum angle formed by an optical axis and an outermost component of the second laser light (LB2).

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

A laser processing apparatus emits processing light, measurement light, processing guide light, and measurement guide light with which a surface of a workpiece is irradiated. Respective wavelengths of the processing guide light and the measurement guide light are set to wavelengths at which a deviation amount between an irradiation position of the processing guide light and an irradiation position of the measurement guide light due to a chromatic aberration of magnification of a lens, and a deviation amount between an irradiation position of the processing light and an irradiation position of the measurement light due to the chromatic aberration of magnification of the lens are equal to each other. Therefore, positioning of spot positions of a plurality of laser lights having different output differences can be realized with high accuracy and high speed.

A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.