A method for cutting workpieces of different thicknesses includes providing at least one unprocessed laser beam, selectively forming a processing laser beam from the at least one unprocessed laser beam in accordance with a thickness of the workpiece, and cutting the workpiece with the processing laser beam. Forming the processing laser beam includes selectively coupling one or more unprocessed laser beams into one or more of a plurality of parallel, non-concentric fibers of a compound fiber, the plurality of fibers of the compound fiber having different cross-sectional shapes. A laser beam characteristic of the processing laser beam exiting the compound fiber differs depending upon which fibers of the compound fiber receive the at least one unprocessed laser beam, the laser beam characteristic of the processing laser beam differing depending on the thickness.

A machining apparatus for laser machining a work-piece, in particular for laser cutting, is provided, having a device for generating a machining laser beam, for rough machining the work-piece, in particular for producing cuts with cut edges in the workpiece, and having a device for splitting the machining laser beam into at least two energy intensity ranges, wherein a first energy intensity range for rough machining of the workpiece has a greater time-integrated radiation energy than at least one second energy intensity range for at least partially fine machining a cut edge. Further provided is a method a for laser machining a workpiece.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

A method of separating a wafer into at least two thinner wafers includes a pressing member placing step of placing a pressing member that is transmissive of a wavelength of a laser beam on a first surface of the wafer such that the pressing member is pressed against the first surface of the wafer, a separation initiating point forming step of forming a separation initiating point in the wafer by applying the laser beam whose wavelength is transmittable through the wafer to the wafer while positioning a focused spot of the laser beam within the wafer and moving the focused spot and the wafer relatively to each other along a first direction, and an indexing feed step of moving the focused spot and the wafer relatively to each other along a second direction perpendicular to the first direction.

A method and an apparatus for processing an object by generation of laser radiation as a collimated laser beam, influencing the intensity distribution and/or the phase progression over the cross section of the laser beam, splitting the laser beam into two partial beams, and deflection and focusing of the partial beams so that the partial beams are superimposed in a processing zone in the material of the object.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

A control unit performs first processing of irradiating an object with laser light while relatively moving a first converging point and a second converging point along a first line, in a state where a distance between the first converging point and a second converging point is set as a first distance, and performs second processing of irradiating the object with the laser light while relatively moving the first converging point and the second converging point along a second line, in a state where the distance between the first converging point and the second converging point is set to a second distance smaller than the first distance.

A control unit performs first processing of irradiating an object with laser light while relatively moving a first converging point and a second converging point along a first line, in a state where a distance between the first converging point and a second converging point is set as a first distance, and performs second processing of irradiating the object with the laser light while relatively moving the first converging point and the second converging point along a second line, in a state where the distance between the first converging point and the second converging point is set to a second distance smaller than the first distance.

A pulse duration measuring apparatus includes a polarizing beam splitter for splitting a pulsed laser beam into a first laser beam and a second laser beam, a first mirror for reflecting the first laser beam traveling toward the polarizing beam splitter, a second mirror for reflecting the second laser beam traveling toward the polarizing beam splitter, a first quarter wavelength plate disposed between the polarizing beam splitter and the first mirror, a second quarter wavelength plate disposed between the polarizing beam splitter and the second mirror, an optical path length changing unit for moving the first mirror or the second mirror to change the length of the respective optical paths, a nonlinear crystal body for allowing a combined laser beam to pass therethrough, and a photodetector for measuring an optical intensity of the combined laser beam that has passed through the nonlinear crystal body.