B23K26/073

WELDING METHOD AND WELDING APPARATUS FOR WELDING CONDUCTOR ENDS
20230073600 · 2023-03-09 ·

To improve quality and reduce reject in the large-scale production of components of an electrical machine provided with coil windings, a welding method is provided for welding conductor ends organized into groups of conductor ends of a component for an electrical machine. The method includes detecting a relative position of a first conductor end and a second conductor end of a group of conductor ends, and controlling a welding energy input to the conductor ends to be welded depending on the detected relative position. A welding apparatus for performing the welding method is also provided.

Rotary beam symmetrizer

An optical device may include a polarization splitter to split a unidirectional rotary optical beam into a first rotary optical beam having a first polarization state and a second rotary optical beam having a second polarization state. The unidirectional rotary optical beam and the second rotary optical beam may have optical power with a first direction of spatial rotation. The optical device may include a reflective element to reverse a parity of the first rotary optical beam in association with causing optical power of the first rotary optical beam to have a second direction of spatial rotation. The optical device may include a polarization combiner to, after reversal of the parity of the first rotary optical beam, combine the first rotary optical beam and the second rotary optical beam to create a bi-directional rotary optical beam having the first polarization state and the second polarization state.

Rotary beam symmetrizer

An optical device may include a polarization splitter to split a unidirectional rotary optical beam into a first rotary optical beam having a first polarization state and a second rotary optical beam having a second polarization state. The unidirectional rotary optical beam and the second rotary optical beam may have optical power with a first direction of spatial rotation. The optical device may include a reflective element to reverse a parity of the first rotary optical beam in association with causing optical power of the first rotary optical beam to have a second direction of spatial rotation. The optical device may include a polarization combiner to, after reversal of the parity of the first rotary optical beam, combine the first rotary optical beam and the second rotary optical beam to create a bi-directional rotary optical beam having the first polarization state and the second polarization state.

Method of determining whether or not result of processing process of laser processing apparatus is acceptable

There is provided a method of determining whether or not a result of a processing process of a laser processing apparatus is acceptable including a laser processing step of applying a laser beam to predetermined processing regions of a workpiece held on a chuck table, thereby performing a piercing process on the workpiece, an image capturing step of capturing images of all the processing regions while moving the image capturing unit and the workpiece relatively to each other, a detecting step of detecting regions where light is not transmitted through the workpiece among the processing regions in the image captured in the image capturing step, and a determining step of determining that the laser processing apparatus needs to be readjusted if the regions where light is not transmitted through the workpiece is equal to or more than the predetermined quantity.

PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
20230105004 · 2023-04-06 · ·

A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.

PROCESSING APPARATUS USING LASER, METHOD OF PROCESSING A SUBSTRATE USING LASER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
20230105004 · 2023-04-06 · ·

A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.

LASER PROCESSING SYSTEM AND METHOD THEREOF

A laser processing system according to an embodiment of the present invention includes: a laser unit emitting a laser beam; an optical unit disposed on a propagation path of the laser beam and modulating the incident laser beam into a Bessel beam; a stage on which a workpiece to be processed with the Bessel beam emitted from the optical unit is mounted; and a control unit for controlling the operations of the laser unit, the optical unit, and the stage, wherein the optical unit is configured to position the focus line of the emitted Bessel beam on the workpiece and to move the focus line positioned on the workpiece with a predetermined range.

LASER MACHINING DEVICE AND LASER MACHINING METHOD
20230150067 · 2023-05-18 · ·

Provided is a laser processing device for forming a modified region by irradiating an object with laser light. The device includes a support portion configured to support the object, a laser irradiation unit configured to irradiate the object supported by the support portion with the laser light, a moving mechanism that moves at least one of the support portion and the laser irradiation unit such that a converging point of the laser light relatively moves with respect to the object, and a control unit that controls the laser irradiation unit and the moving mechanism. A first line extending along a first direction and a second line extending along a second direction intersecting the first direction and extending beyond the first line when viewed from a direction intersecting an incident surface of the laser light are set in the object.

LASER MACHINING DEVICE AND LASER MACHINING METHOD
20230150067 · 2023-05-18 · ·

Provided is a laser processing device for forming a modified region by irradiating an object with laser light. The device includes a support portion configured to support the object, a laser irradiation unit configured to irradiate the object supported by the support portion with the laser light, a moving mechanism that moves at least one of the support portion and the laser irradiation unit such that a converging point of the laser light relatively moves with respect to the object, and a control unit that controls the laser irradiation unit and the moving mechanism. A first line extending along a first direction and a second line extending along a second direction intersecting the first direction and extending beyond the first line when viewed from a direction intersecting an incident surface of the laser light are set in the object.

LASER PROCESSING DEVICE AND INSPECTION METHOD
20230146811 · 2023-05-11 · ·

A laser processing device includes: a stage that supports a wafer having a front surface, on which a plurality of functional elements are formed and a street region extends so as to pass between adjacent functional elements, and a back surface on a side opposite to the front surface; a light source that emits laser light to the wafer from the front surface side to form one or more modified regions inside the wafer; a spatial light modulator as a beam width adjusting unit; and a control unit that controls the spatial light modulator so that the beam width of the laser light is adjusted to be equal to or less than the width of the street region and a target beam width according to surface information including the position and height of a structure forming a functional element adjacent to the street region.