In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a property of the blind via, the property comprising one or more of a top diameter, a bottom diameter, a volume, or a taper angle; focusing a Gaussian laser beam, under laser process parameters, at the substrate surface to remove at least a portion of the mask layer; adjusting the laser process parameters based on the property; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. The mask layer can be pre-etched. Apparatus for forming a blind via in a substrate are also provided.

Various arrangements and methods are disclosed for forming one or more perforations on a substrate surface using a laser system, at least one rotating polygon mirror, and at least one other movable mirror. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface by incrementing (e.g., moving) a first mirror between a plurality of fixed (e.g., pointing) positions. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate using a first mirror that is maintained in a fixed (e.g., pointing) position. A first rotating polygon mirror and a second rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface, where the first and second polygon mirrors are used to define an extent of a given perforation in two dimensions on the substrate.

In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.

A laser scanner includes a rotary member, light-transmitting glasses, and a mirror. The rotary member rotates about a rotation axis. The light-transmitting glasses are disposed on the rotary member. The mirror guides a laser beam such that the laser beam is incident on the light-transmitting glass. When the rotary member is viewed in a direction parallel to the rotation axis, a polygon is formed by connecting inner surfaces of the light-transmitting glasses. Given that the angle formed between the inner surface of each light-transmitting glass and a straight line parallel to the rotation axis is defined as an inclination angle, the inclination angles of at least two of the light-transmitting glasses have different values.

An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one light source configured to generate a first light beam and a second light beam, a polygon minor scanner, an actuator, and a galvo minor scanner. The polygon minor scanner is configured to receive the first light beam and reflect the first light beam towards the platform. Rotation of the first polygon mirror causes the light beam to move in a first direction along a path on a layer of feed material on the platform. The actuator is configured to cause the path to move along a second direction at a non-zero angle relative to the first direction. The galvo mirror scanner system is configured to receive the second light beam and reflect the second light beam toward the platform.

The light guide device includes a first light guide part, a polygon mirror, a second light guide part, and an adjustment part. The first light guide part reflects and guides the laser light emitted from the laser generator. The polygon mirror has a reflective part (33), and the reflective part (33) reflects the laser light guided by the first light guide part while the reflective part (33) rotates. The second light guide part reflects the laser light reflected at the reflective part (33) of the polygon mirror and directs the light so that the laser light is illuminated to the workpiece at each reflective part (33), respectively. The adjustment part adjusts the position of the light incident on the polygon mirror in the rotation axis direction of the optical axis, thereby changing the positions of light incident on the irradiation target in the line width direction. The irradiation target is irradiated with the light while the position of the light in a line width direction.

The light guide device includes a first light guide part, a polygon mirror, and a second light guide part. The first light guide part reflects and guides the laser light emitted from the laser generator. The polygon mirror is configured to be rotatable and includes a plurality of reflective parts (33), the reflective parts (33) being arranged to form a regular polygonal reflective surface when viewed in a rotation axis direction, the polygon mirror reflecting the laser light guided by the first light guide part by the reflective part while rotating. The second light guide part reflects the laser light reflected at the reflective part (33) of the polygon mirror and guides the laser light so that the laser light is irradiated to the workpiece at each of the reflective parts (33). The reflective part (33) of the polygon mirror is configured to reflect the incident laser light so that the optical axis of the incident light offset in the rotation axis direction. At least two reflective parts (33) differ from each other in position in the rotation axis direction.

To optimize equipment and processes to enhance magnetic domain refinement efficiency and to enhance workability to improve processing capability, a method of refining a magnetic domain of a grain-oriented electrical steel plate includes zigzag controlling for transferring the steel plate without being inclined in right and left directions along a production line center, steel plate support roll position adjusting for controlling a position of the steel plate in up and down directions while supporting the steel plate, laser beam irradiating for irradiating a laser beam to a surface of the steel plate to melt the steel plate to form a groove in the surface of the steel plate, and removing for absorbing and removing radiant heat due to reflection of the laser beam irradiated to the surface of the steel plate during the laser beam irradiating.

A laser processing apparatus includes a liquid supply mechanism at an upper portion of a holding unit. The liquid supply mechanism includes: a liquid chamber provided with a transparent plate located with a gap formed between the transparent plate and an upper surface of a workpiece held by the holding table; a liquid supply nozzle adapted to supply a liquid to the gap from one side of the liquid chamber; and a liquid discharge nozzle adapted to recover the liquid from the other side of the liquid chamber, to produce a flow of the liquid. A laser beam applying unit includes a condenser adapted to focus a laser beam emitted by a laser oscillator, to apply the laser beam to the workpiece held by the holding table through the transparent plate and the liquid supplied to the gap.