A cutting device for a thin semiconductor wafer includes a laser light generator and a polygonal mirror structure. The laser light generator is used to provide a femtosecond laser light with a pulse width on a femtosecond order (10.sup.−15 second). The polygonal mirror structure is used to reflect the femtosecond laser light. The polygonal mirror structure has a plurality of reflective surfaces. The polygonal mirror structure rotates continuously with respect to the femtosecond laser light, such that the femtosecond laser light is sequentially and repeatedly reflected by the plurality of reflective surfaces and projected on a semiconductor wafer. The femtosecond laser light projected on a semiconductor wafer moves repeatedly along a same predetermined direction in a predetermined range during a predetermined time to groove or cut the semiconductor wafer.

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO.sub.2 laser beam the coating via a CO.sub.2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO.sub.2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO.sub.2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

The present invention relates to a three-dimensional printing apparatus using a digital light processing (DLP) projector with a laser scanner, the apparatus comprising: a resin storage unit storing a photocurable resin; a DLP projector unit projecting light to the resin storage unit; a molding stage unit provided to be capable of being lifted and lowered in a vertical direction from a bottom of the resin storage unit; a laser scanner unit performing scanning of light for the resin storage unit; a scanner transfer unit allowing the laser scanner unit to move in an x-axis direction; an image processing unit dividing one sectional image of a sculpture into a core portion and a shell portion; and a controller receiving data on the core portion and the shell portion from the image processing unit, controlling the DLP projector, the laser scanner unit, the scanner transfer unit, and the molding stage unit.

A laser beam applying unit of a laser processing apparatus includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser beam emitted from the laser oscillator and to thereby apply the laser beam to the workpiece held by a holding unit, and a liquid layer former disposed at a lower end portion of the condenser and adapted to form a layer of a liquid on an upper surface of the workpiece. The liquid layer former includes a casing having a bottom wall that forms a gap between itself and the upper surface of the workpiece, a liquid supply section adapted to supply the liquid to the casing, and a transparent section that is formed at the bottom wall adjacently to the jet port and that permits transmission of the laser beam therethrough.

A laser irradiation apparatus includes: a laser module configured to emit a laser beam; a first optical system configured to scan the laser beam emitted from the laser module along a first direction; an optical element configured to refract the laser beam emitted from the first optical system; and a substrate supporter on which a base substrate to which the laser beam refracted through the optical element reaches is arranged.

A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

A surface treating method and apparatus include operating a quasi-continuous wave fiber laser and pre-scan shaping the laser beam such that an instantaneous spot beam has predetermined geometrical dimensions, intensity profile, and power; operating a scanner at an optimal angular velocity and angular range to divide the pre-scan beam into at least one sub-beam deflected toward the surface being processed; guiding the sub-beam through a post-scan optical assembly to provide the spot beam with predetermined geometrical dimensions, power, and angular velocity and range, which are selected such that the instantaneous spot beam is dragged in a scan direction over a desired length at a desired scan velocity, which allow the treated surface to be exposed for a predetermined exposure duration and have a predetermined fluence distribution providing the treated surface with a quality comparable to that of the surface processed by an excimer laser or a burst-mode fiber laser.

A deposition method is provided wherein a donor substrate (10) is arranged opposite a target substrate (20), the donor substrate having a surface (12) facing the target substrate that is provided with a viscous donor material (14). An optical beam (30) is directed via the donor substrate to the donor material so as to release the donor material and to therewith transfer the donor material as a jet towards the target substrate. In the method provided herein an input signal (D.sub.S) is received that specifies a shape to be assumed by the jet with which the donor material is to be transferred and an energy profile of the optical beam is accordingly controlled. Additionally or alternatively the energy profile of the optical beam may be controlled in accordance with a pattern according to which the donor material is to be deposited on the target substrate. Likewise a corresponding deposition apparatus is provided.

The present invention introduces a scanning arrangement and a method suitable for coating processes applying laser ablation. The arrangement is suited to prolonged, industrial processes. The arrangement comprises a target, which has an annular form. The laser beam direction is controlled by a rotating mirror locating along the center axis of the annular target. The scanning line will rotate circularly along the inner target surface when the mirror rotates. The focal point of the laser beams may be arranged to locate on the inner target surface to ensure a constant spot size. A ring-formed, a cylinder-shaped or a cut conical-shaped target may be used. The inner surface of the target may thus be tapered in order to control the release direction of the ablated material towards a substrate to be coated.

A light illumination device, a light processing apparatus using the light illumination device, a light illumination method, and a light processing method. The light illumination device, the light illumination method, and the light processing method include converting a phase distribution of a transmitted wavefront of light emitted from a light source, changing a ratio between a first diameter of a cross section perpendicular to an optical axis of the light whose phase distribution of the transmitted wavefront is converted in the converting along a first axis and a second diameter along a second axis perpendicular to the first axis and the optical axis of the light, and condensing the light whose ratio between the first diameter and the second diameter is changed in the changing.