A laser processing apparatus and a laser processing method for improving the processing speed and forming uniform and highly accurate through holes when processing for forming fine through holes in a matrix in a long thin plate, and a thin plate having through holes in a matrix formed by such laser processing. A laser processing apparatus includes a cylindrical body having an opening on a circumferential surface around which a thin plate to be processed is wound obliquely, a thin plate transfer for transferring a thin plate wound around the cylindrical body in the longitudinal direction of the thin plate, a motor having a rotation axis arranged coaxially with a central axis of the cylindrical body, a reflecting member fixed to a rotating shaft of the motor, a laser light emitting means for emitting pulsed light. The apparatus continuously opens through holes in the thin plate.

Provided is a mask changing unit for a laser bonding apparatus, and more particularly, a mask changing unit for a laser bonding apparatus, wherein the mask changing unit supplies or changes a mask to or in the laser bonding apparatus for bonding a semiconductor chip to a substrate by using a laser beam.

According to the mask changing unit for a laser bonding apparatus, a plurality of masks that are used in performing laser bonding of a semiconductor chip to a substrate while the semiconductor chip is being pressed may be easily supplied to the laser bonding apparatus or changed in the laser bonding apparatus.

The automated trimming of an untrimmed plant stem comprises a device for transporting an untrimmed plant stem to an imaging stage, using a camera to capture at least one image of the plant stem, sending the at least one image to a central processor which creates a trim map which constructs a pattern for moving a cutting armature along the plant stem, and trimming the plant stem by cutting structure of the cutting armature to change the untrimmed plant stem to a trimmed plant stem.

A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).

A manufacturing method and a manufacturing apparatus for a separator layer-coated electrode are provided capable of shortening the time required to cut out a separator layer-coated electrode with a laser beam. In a cutting process, a laser beam is irradiated to a laser irradiation target portion of a strip-shaped separator layer-coated electrode from a front-side separator layer side to cut a strip-shaped separator layer-coated electrode. Prior to the cutting process, a preheating process is conducted to preheat the front-side separator layer in the laser irradiation target portion.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.

A support system for holding a sheet of material being cut by a laser has a base and a number of needles extending upwardly from the base. A vacuum generator or suction mechanism is in communication with a lumen in each needle to hold the sheet atop the bed of needles and spaced from the base so as to avoid scorching the sheet by the laser.

A conveyor system for rapidly moving and simultaneously processing material sheets through several processing stations, the conveyor system including a chain that moves in an endless loop, and noncontiguous operational and standby skid sections for supporting material sheets and moving with the chain in the endless loop; wherein the conveyor indexes through the processing stations, such that, after each indexing, the conveyor has one skid section that is in operational position associated with each of the processing stations, thus allowing each of the processing stations to operate simultaneously on the associated skid section, during each time period when the conveyor is stopped, after each indexing.

A laser cutting system wherein a conveyor system indexes sheet material through various processing stations, the processing stations operating simultaneously during the time period when the conveyor is stopped and wherein the conveyor system is in the form of an endless belt.

A welded shaped steel manufacturing device includes: a plate conveying device configured to convey a web member and two flange members in a conveyance direction; and a laser welding device configured to laser-weld butt portions of ends of the web member butting against the two flange members for weld-bonding, wherein the plate conveying device includes a web member holding device having surface side rollers arranged at intervals in the conveyance direction in a position not to block laser irradiation from the laser welding device toward welding points, and wherein the web member is held with the surface side rollers over a predetermined range in the conveyance direction, and wherein side ends of the surface side rollers facing the two flange members are positioned along boundaries of areas having spatters dispersed from the welding points in a degree exceeding a predetermined value.