A Support device (14) for storing or transporting single sheets or stacks of a packaging material is described. It comprises a multitude of slats (32) being arranged on a basic component (34), wherein the slats (32) are in an upright position and spaced from each other in a generally parallel manner such that respective side contour contact sections (36) of the slats (32) form a substantially flat support surface configured to support the single sheets or stacks. Each slat (32) is mounted on the basic component (34) via two connection tongues (52) being arranged on opposite ends of the slat (32), the connection tongues (52) engaging corresponding connection slots (54) being provided on the basic component (34)), wherein two types of slots (54) are provided on the basic component (34), wherein a first type of slots (54) is arranged closer to a basic surface of the basic component (34) than a second type of slots (54), and wherein two types of slats (32) are provided, wherein a first type of slats (32) is engageable with connection slots (54) of the first type, but not with connection slots (54) of the second type, and a second type of slats (32) is engageable with connection slots (54) of the second type, but not with connection slots (54) of the first type.

An oscillator unit has: a housing for housing a laser beam source and a laser beam source drive circuit; and connection portions connected to cables at a side of the housing, connection portions connected to cables at the side, and a connection portion connected to an optical fiber cable at the side.

A machining swarf removing apparatus includes a left and a right machining swarf removing units. When removing machining swarf adhered to a recovery box, the left machining swarf removing unit is placed in removal starting position. A brush enters an insertion-ready state in which transverse direction thereof is oriented in a second direction D2. The brush is moved to an insertion position for insertion into the recovery box, then the brush is rotated to enter a machining swarf removal-ready state in which a longitudinal direction thereof is oriented in the second direction D2. The left machining swarf removing unit is moved to remove the machining swarf adhered to the recovery box by the brush, while a left rod vibrating device is driven to vibrate a rod, vibrating the brush attached to the rod.

A laser etching system for marking one or more objects stored in a container includes a conveyor line and a conveyor drive. A laser etching unit is disposed above at least the second portion of the conveyor line and has a laser engine unit and a scan head assembly communicatively connected to the laser engine unit. A laser distance sensor is configured to detect an open container having one or more objects stored therein by taking a distance measurement from and differentiating between a low surface and a high surface, wherein the low surface corresponds to a conveyor surface of the second portion that is positioned directly underneath the laser distance sensor.

An apparatus for cutting electrode sheets includes a conveyor and a laser device. The conveyor is configured to move an original sheet including an electrode portion and an ear portion extending from an edge of the electrode portion. The laser device is configured to move a laser to cut out a tab connected to the electrode portion from the ear portion of the original sheet. The laser device is also configured to move the laser from one edge of the electrode portion to another edge of the electrode portion to cut and separate a respective electrode sheet including the tab from the original sheet. The laser is configured to cut out the tab from the ear portion and cut and separate the respective electrode sheet including the tab from the original sheet as the conveyor is moving the original sheet.

An apparatus for manufacturing a display device include: a tray on which a window is seated, a belt on which the tray is seated, where the tray is moved by the belt, a first pulley which rotatably supports the belt, a second pulley arranged to be spaced apart from the first pulley, where the second pulley rotatably supports the belt, and a driving portion connected to the second pulley, where the driving portion rotates the second pulley.

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

A laser processing machine includes a guide member with which a laser head is engaged so as to be movable to one side in a conveying direction, a moving device configured to move the laser head along the guide member, a counterweight which is movably engaged to the other side of the guide member in the conveying direction and moves along the guide member in a direction opposite to a moving direction of the laser head in conjunction with the laser head moved by the moving device, and a control device which controls the moving device to move the counterweight to a position facing the grease feeding device and to perform grease feeding to an engaged portion between the counterweight and the guide member.

Provided is an electrode sheet manufacturing apparatus that forms an electrode sheet by cutting a sheet stack including an electrode composite material layer and a separator provided on the electrode composite material layer. The electrode sheet manufacturing apparatus includes a laser irradiation device that irradiates the sheet stack with a first laser beam having a wavelength to be absorbed by the separator and a second laser beam having a wavelength to be absorbed by the electrode composite material layer, and a controller that controls driving of the laser irradiation device. The controller moves an irradiation position of the first laser beam relative to the sheet stack and moves an irradiation position of the second laser beam so as to follow a track of the irradiation position of the first laser beam.

A pattern formation apparatus is configured to irradiate each of a plurality of base materials being conveyed, with laser such that one of a light path length and a beam size at a position of the plurality of base materials is approximately constant, to form a pattern on a surface of each of the plurality of base materials.