A method for flame cutting of a workpiece, in particular a planar workpiece, with a thickness of at least 10 mm is performed by a laser beam with power of more than 10 kW and with oxygen as a cutting gas. Accordingly, a focal position in the beam direction of the laser beam is located within the workpiece at a depth that is greater than half the thickness of the workpiece. The laser beam emerges from a nozzle opening of a cutting gas nozzle together with the cutting gas, wherein a distance of a workpiece-side nozzle end face from the workpiece surface is at least 2 mm, preferably at least 3 mm, particularly preferably at least 5 mm.

A laser apparatus includes a laser generator configured to generate a first laser beam proceeding along a first direction, and an inversion module configured to convert the first laser beam to a second laser beam proceeding along the first direction, the inversion module including a splitter configured to form a reflected laser beam by partially reflecting the first laser beam, and a transmitted laser beam by partially transmitting the first laser beam, and a prism configured to reflect the reflected laser beam.

Systems and methods are described for managing articles. The systems and methods described herein may comprise an example method for manufacturing an article. The systems and methods provides an end-to-end manufacturing value chain as a closed system and feedback loop.

A cutting apparatus comprising a cutting table and a first cutting material belt movably supported about the cutting table about a first roller and a second roller. A second cutting material belt is removably supported above the first cutting material belt about the first roller and a third roller, wherein the second roller is intermediate the first roller and the second roller.

A laser engraving machine having dual quick release mirror holders is provided. The laser engraving machine comprises a machine station, a first mirror holder and a second mirror holder. The machine station has a working platform, a rail and a first laser tube. The first mirror holder is disposed on the rail and receives the laser light emitted from the first laser tube for carrying out a laser processing on the working platform when moves back and forth on the rail. The second mirror holder is composed of a second laser tube assembled on an output module, wherein the output module has a first binding portion and a second binding portion. The first binding portion detachably attaches to the rail for the second mirror holder to move on the rail. The second binding portion detachably attaches to the first mirror holder.

Methods, devices, and systems for beam processing of plate-shaped or tubular workpieces are provided. In one aspect, a method includes: generating at least one section of a cutting gap cutting through the workpiece along a cutting line corresponding to at least part of a contour of a workpiece part to be produced from the workpiece by a processing beam, and performing at least one non-joining and non-cutting finishing treatment of the workpiece with a partially cut-out workpiece part at least in one section of at least one finishing zone by the processing beam, the finishing zone extending along the cutting line.

Reclamation or recycling of a semiconductor workpiece includes vaporizing the structures and materials deposited, implanted, or formed in or on the substrate with minimally acceptable damage to the crystalline substrate through direct ionic vaporization rather than thermal ablation. The purity of the substrate therefore remains substantially free from heavy metal surface contamination and has a surface roughness that may be polished back to a mirror-like finish using chemical mechanical polishing or lapping processes. The process includes focusing coherent light on a surface of the substrate with a predetermined wavelength, power, pulse width, and pulse rate or number of pulses per unit area that causes direct ionic vaporization of material formed in or on the surface of the substrate up to a predetermined penetration depth. Advantageously, patterned, previously used test, and out of specification wafers may be reclaimed for reuse or recycled without risk of the unintended disclosure of intellectual property.

Disclosed herein is a film cutting system for dividing and forming a film sheet having a predetermined unit width and unit length from a raw film by laser cutting of the raw film. The film cutting system includes: a supply unit configured to intermittently supply the raw film by a predetermined unit supply length in a length direction of the raw film; a first laser unit including first and second laser nozzles each configured to radiate a laser beam onto the raw film, and a first head driver configured to convey the first laser nozzle and the second laser nozzle in a width direction of the raw film perpendicular to the length direction in a reciprocating manner; and a second laser unit including a laser nozzle disposed spaced apart from the first laser unit by the unit length in the length direction and configured to radiate a laser beam onto the raw film, and a second head driver configured to convey the laser nozzle in the width direction in a reciprocating manner, wherein, when the raw film is supplied by the supply unit, the first head driver dispose the first laser nozzle and the second laser nozzle so as to be spaced apart from each other by the unit width, and each of the first laser nozzle and the second laser nozzle radiates, in the length direction, the laser beam onto the raw film supplied by the supply unit to slit the raw film, and wherein, when the slitting of the raw film is completed, the supply unit stops supplying the raw film; the first head driver conveys one of the first laser nozzle and the second laser nozzle in the width direction; the second head driver conveys the laser nozzle in the width direction; and the one of the first laser nozzle and the second laser nozzle and the laser nozzle respectively radiate the laser beam onto the raw film in the width direction to cut the raw film to divide and form the film sheet from the raw film.

Provided is a workpiece edge position detection device with which it is possible to accurately detect the position of a workpiece edge even under conditions in which an inclined portion is present on the workpiece. A workpiece edge position detection device includes: a control unit that controls the position of a machining head, on which a gap sensor is mounted, such that a spacing with respect to the workpiece as detected by the gap sensor remains fixed while the machining head is scanned along the surface of the workpiece; and a workpiece edge detection unit that, during execution by the control unit of the control for keeping the gap fixed, detects the position of an end section of the workpiece on the basis of the coordinate position of the machining head when the amount of variation in the spacing between the gap sensor and the workpiece has reached or exceeded a prescribed threshold value.

A described method includes engraving, marking and/or inscribing a workpiece using a laser plotter. In a housing of the laser plotter, one, preferably more, in particular two laser sources in the form of lasers have an effect preferably alternating on the workpiece to be processed. The workpiece is laid in a defined manner on a processing table and a laser beam emitted from the beam source is transmitted to at least one focusing unit via deflection elements and the laser beam is diverted toward the workpiece and focused for processing. A sequence control adapted to the quality of the engraving is determined and/or carried out by a control unit and the focusing unit on the carriage is controlled corresponding to the defined parameters of the sequence control.