A method for separating a workpiece includes providing ultrashort laser pulses using an ultrashort pulse laser, and introducing material modifications into the workpiece along a separation line using the ultrashort laser pulses. The workpiece includes a transparent material. The method further includes separating the material of the workpiece along the separation line. The laser pulses form a laser beam that is incident onto the workpiece at a work angle. An optical aberration of the laser pulses during a transition into the material of the workpiece is reduced by an aberration correction device. The laser beam has a non-radially symmetric transverse intensity distribution, with the transverse intensity distribution appearing elongate in a direction of a first axis in comparison with a second axis perpendicular to the first axis.

A system that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, of individual beams. Laser beam micro scanner modules (MSMs) are arranged into 2D arrays or matrices. During operation of the MSMs, a fiber tip that projects the laser beam is displaced along the x and y-axis in order to scan the focal spot. Each MSM within a matrix can process a corresponding cell (e.g., one square centimeter) during focal spot scanning, and the plurality of MSMs may be operated in parallel to process a plurality of corresponding cells (e.g., with a 10×10 matrix of MSM, 100 cm.sup.2) without rastering or otherwise repositioning the assembly over the build surface.

Systems and methods for cutting objects within a subterranean well include a laser system having a laser drilling head located at a terminal downhole end of a laser tool body directing a head laser beam in a direction downhole. A laser scanner assembly located within the laser tool body has a scanner head directing a scanner laser beam and can move both axially along a length of the laser tool body and rotate around a central axis of the laser tool body. A laser cutter assembly located within the laser tool body has a cutter head directing a cutter laser beam and can rotate around the central axis of the laser tool body. A cable bundle formed of a plurality of fiber optic cables extends from an uphole end of the laser tool body to each of the laser drilling head, the laser scanner assembly, and the laser cutter assembly.

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

An apparatus for fabricating a part, comprising a curved shaft; a build plate connected to the curved shaft; a motor; and a transmission connecting the motor and the curved shaft. The build plate moves along a curved path having a radius of curvature originating on an axis when the transmission transfers power from the motor to the curved shaft. Material deposited on the build plate along the curved path forms the part comprising a solid of revolution around the axis. In one or more examples, the part is an aircraft engine inlet.

An apparatus for 3D laser printing and a method for fusing a metal material with control of a melt pool on a substrate are provided. The apparatus contains a metal wire or powder feed unit and a plurality of laser sources symmetrically arranged on the surface of an imaginary hemisphere. Each laser source contains a laser with a laser beam focusing lens that focuses the laser beam in a focal point at a given distance from the focusing lens. The laser source is also provided with CPU/GPU-controlled devices for independently shifting each laser or a group of lasers along the optical axis and/or for tilting the lasers relative to the longitudinal axis of the source housing so that heating or fusing can be performed by placing the focal points of the lasers selectively at any point of the material or on a substrate for forming and controlling the melt pool.

A method for processing a crystalline substrate to form multiple patterns of subsurface laser damage facilitates subsequent fracture of the substrate to yield first and second substrate portions of reduced thickness. Multiple (e.g., two, three, or more) groups of parallel lines of multiple subsurface laser damage patterns may be sequentially interspersed with one another, with at least some lines of different groups not crossing one another. Certain implementations include formation of multiple subsurface laser damage patterns including groups of parallel lines that are non-parallel to one another, but with each line remaining within ±5 degrees of perpendicular to the <1120> direction of a hexagonal crystal structure of a material of the substrate. Further methods involve formation of initial and subsequent subsurface laser damage patterns that are centered at different depths within an interior of a substrate, with the subsurface laser damage patterns being registered with one another and having vertical extents that are overlapping.

Provided is a laser processing system with which correction of a path of a laser illumination point can be carried out easily. This laser processing system is provided with a scanner, a moving device, a scanner control device for controlling the scanner, and a program generation device, wherein the program generation device converts a scanner program to a control point correction program for correcting a preset control point, the scanner control device has a trajectory control unit for controlling the scanner on the basis of the control point correction program such that a workpiece is illuminated with a control point correction trajectory for correcting the control point in a state in which the movement device is stopped, and the trajectory control unit controls the scanner on the basis of the control point correction program such that the control point correction trajectory is repeatedly scanned at predetermined intervals.

Provided is a laser processing system with which correction of a control point can be carried out easily. This laser processing system is provided with a scanner capable of scanning a workpiece with laser light, a moving device for moving the scanner relative to the workpiece, and a scanner control device for controlling the scanner, wherein the scanner control device has an irradiation control unit for controlling the scanner such that the same preset control point on the workpiece is irradiated with the laser light when the scanner has been stopped at a plurality of positions by the moving device.

A moveable head of a computer numerically controlled machine may deliver electromagnetic energy sufficient to cause a first change in a material at least partially contained within an interior space of the CNC machine. A feature of the material may be imaged using at least one camera present inside the interior space to update a position of the material, and the moveable head may be aligned to deliver electromagnetic energy sufficient to cause a second change in the material such that the second change is positioned on the material consistent with the first change and with an intended final appearance of the material. Methods, systems, and article of manufacture are described.